Inventor · disambiguated record
Philipp Kneissl
Also filed as: KNEISSL PHILIPP
1 granted patent·3 pending applications·1 citations·filing 2017–2023
15Inventor score
Files withSIEMENS AG4
Top patents by PatentIndex Score
4 records- 0150US2023307250A1Method for producing an apparatus having a metal body for cooling a semiconductor arrangementSIEMENS AG·Filed 2023·Application pending·0 cites
- 0242US10886641B2Copper busbar for a contact systemSIEMENS AG·Filed 2017·Granted Jan 5, 2021·1 cites·6 claims
- 0340US2024096844A1Bonded connection meansSIEMENS AG·Filed 2021·Application pending·0 cites
- 0439US2024088110A1Power converter with at least two power semiconductor modulesSIEMENS AG·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →