Inventor · disambiguated record

Philippe Le Duc

Also filed as: LE DUC PHILIPPE

1 granted patent·6 citations·filing 2008–2008

27Inventor score

Technology areasH10P

Files withROUSSEVILLE LUCIE1

Top patents by PatentIndex Score

1 record

0162US8395399B2Semiconductor device and wafer with a test structure and method for assessing adhesion of under-bump metallizationROUSSEVILLE LUCIE·Filed 2008·Granted Mar 12, 2013·6 cites·12 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →