Inventor · disambiguated record
Phuc M. Nguyen
Also filed as: NGUYEN PHUC M
5 granted patents·1 pending application·5 citations·filing 2013–2023
68Inventor score
Top patents by PatentIndex Score
6 records- 0174US10522615B2Semiconductor package with embedded capacitor and methods of manufacturing sameNXP USA INC·Filed 2016·Granted Dec 31, 2019·2 cites·9 claims
- 0273US2024035797A1Length gaugeUNITED STATES POSTAL SERVICE·Filed 2023·Application pending·0 cites
- 0371US11828589B2Length gaugeUNITED STATES POSTAL SERVICE·Filed 2022·Granted Nov 28, 2023·0 cites·20 claims
- 0466US9601354B2Semiconductor manufacturing for forming bond pads and seal ringsREBER DOUGLAS M·Filed 2014·Granted Mar 21, 2017·2 cites·12 claims
- 0561US10553508B2Semiconductor manufacturing using disposable test circuitry within scribe lanesREBER DOUGLAS M·Filed 2014·Granted Feb 4, 2020·1 cites·5 claims
- 0642US9134366B2Method for forming a packaged semiconductor deviceAJURIA SERGIO A·Filed 2013·Granted Sep 15, 2015·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →