Inventor · disambiguated record
Phu Nguyen
Also filed as: NGUYEN PHU · NGUYEN PHU TUC
3 granted patents·2 pending applications·19 citations·filing 2007–2022
63Inventor score
Top patents by PatentIndex Score
5 records- 0183US7842147B2Composite panel having in-situ thermoset foamed coreM C GILL CORP·Filed 2007·Granted Nov 30, 2010·16 cites·2 claims
- 0269US10933605B2Vibration damping systemTHE GILL CORP·Filed 2016·Granted Mar 2, 2021·3 cites·22 claims
- 0344US2024217122A1Enhanced substrate transfer arm (sta) and pedestal of thermal compression bonding (tcb) and integrated process using thereofINTEL CORP·Filed 2022·Application pending·0 cites
- 0443US12500112B2Nozzle and bond head heater of thermal compression bonding (TCB) tool and die attachment process using thereofINTEL CORP·Filed 2022·Granted Dec 16, 2025·0 cites·19 claims
- 0542US2011039060A1Composite panel having in-situ thermoset foamed coreSHEN HONGBIN·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →