Inventor · disambiguated record
Phongsak Sawasdee
Also filed as: SAWASDEE PHONGSAK
3 granted patents·2 pending applications·0 citations·filing 2021–2023
39Inventor score
Files withUTAC HEADQUARTERS PTE LTD5
Top patents by PatentIndex Score
5 records- 0145US12293972B2Semiconductor device and method of forming leadframe with clip bond for electrical interconnectUTAC HEADQUARTERS PTE LTD·Filed 2021·Granted May 6, 2025·0 cites·29 claims
- 0244US12230615B2Semiconductor packages with vertical passive componentsUTAC HEADQUARTERS PTE LTD·Filed 2021·Granted Feb 18, 2025·0 cites·20 claims
- 0343US2023377896A1Back surface plasma diced wafers and methods thereofUTAC HEADQUARTERS PTE LTD·Filed 2023·Application pending·0 cites
- 0443US2023192478A1Semiconductor Device and Method of Making a MEMS Semiconductor PackageUTAC HEADQUARTERS PTE LTD·Filed 2022·Application pending·0 cites
- 0535US11784102B2Hermetic semiconductor packagesUTAC HEADQUARTERS PTE LTD·Filed 2021·Granted Oct 10, 2023·0 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →