Inventor · disambiguated record
Pheak Ti Teh
Also filed as: TEH PHEAK TI
2 granted patents·2 pending applications·1 citations·filing 2010–2022
30Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0147US2023100829A1Circuit Systems And Methods Using Spacer DiesINTEL CORP·Filed 2022·Application pending·0 cites
- 0245US9337240B1Integrated circuit package with a universal lead frameLEE GUAN KHAI·Filed 2010·Granted May 10, 2016·1 cites·19 claims
- 0339US2021183758A1Conductive polygon power and ground interconnects for integrated-circuit packagesINTEL CORP·Filed 2020·Application pending·0 cites
- 0433US9780040B1Integrated circuit package substrates having a common die dependent region and methods for designing the sameALTERA CORP·Filed 2014·Granted Oct 3, 2017·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →