Inventor · disambiguated record
Phillip R. Troetschel
Also filed as: TROETSCHEL PHILLIP R
3 granted patents·89 citations·filing 1993–1998
77Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0180US5369056AWarp-resistent ultra-thin integrated circuit package fabrication methodSTAKTEK CORP·Filed 1993·Granted Nov 29, 1994·43 cites·18 claims
- 0270US6194247B1Warp-resistent ultra-thin integrated circuit package fabrication methodSTAKTEK GROUP LP·Filed 1998·Granted Feb 27, 2001·27 cites·1 claims
- 0360US5581121AWarp-resistant ultra-thin integrated circuit packageSTAKTEK CORP·Filed 1994·Granted Dec 3, 1996·19 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →