Inventor · disambiguated record
Philip S. Williams
Also filed as: WILLIAMS PHILIP S
1 granted patent·3 pending applications·11 citations·filing 1988–2025
33Inventor score
Top patents by PatentIndex Score
4 records- 0166US2024124750A1Thermally curable hot-melt pressure sensitive adhesiveBASF SE·Filed 2023·Application pending·0 cites
- 0264US2025243384A1Dual curable pressure sensitive adhesiveBASF SE·Filed 2023·Application pending·0 cites
- 0348US2025215282A1Thermally curable hot-melt pressure sensitive adhesiveBASF SE·Filed 2025·Application pending·0 cites
- 0432US4894172AProcess for programming of field-flow franctionationUNIV UTAH·Filed 1988·Granted Jan 16, 1990·11 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →