Inventor · disambiguated record
Pimpa Boonyatee
Also filed as: BOONYATEE PIMPA
2 granted patents·1 pending application·5 citations·filing 2017–2018
43Inventor score
Files withNXP BV3
Top patents by PatentIndex Score
3 records- 0179US10249556B1Lead frame with partially-etched connecting barNXP BV·Filed 2018·Granted Apr 2, 2019·5 cites·18 claims
- 0235US9812339B1Method of assembling semiconductor devices of varying thicknessesNXP BV·Filed 2017·Granted Nov 7, 2017·0 cites·14 claims
- 0326US2019252256A1Non-leaded device singulationNXP BV·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →