Inventor · disambiguated record

Ping Tai Chen

Also filed as: CHEN PING-TAI

1 granted patent·4 pending applications·0 citations·filing 2021–2025

13Inventor score

Technology areasH10W

Files withTAIWAN SEMICONDUCTOR MFG CO LTD5

Top patents by PatentIndex Score

5 records

0172US2024304559A1Chip package structure with buffer structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
0271US2025357220A1Electrical testing of semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0365US11990418B2Chip package structure with buffer structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 21, 2024·0 cites·20 claims
0462US2024387296A1Electrical testing of semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
0553US2024222287A1Package including composite interposer and/or composite packaging substrate and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →