Inventor · disambiguated record
Ping-Tzu Chen
Also filed as: CHEN PING-TZU
12 granted patents·7 pending applications·12 citations·filing 2019–2025
85Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD19
Top patents by PatentIndex Score
19 records- 0197US11282769B2Oversized via as through-substrate-via (TSV) stop layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 22, 2022·4 cites·20 claims
- 0296US11756862B2Oversized via as through-substrate-via (TSV) stop layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·2 cites·20 claims
- 0389US11195818B2Backside contact for thermal displacement in a multi-wafer stacked integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 7, 2021·5 cites·20 claims
- 0485US12191282B2Shared pad/bridge layout for a 3D ICTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 7, 2025·1 cites·20 claims
- 0584US2025105098A1Oversized via as through-substrate-via (tsv) stop layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0682US12205868B2Oversized via as through-substrate-via (TSV) stop layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 0781US12218106B2Backside contact to improve thermal dissipation away from semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
- 0879US2025357421A1Support structure to reinforce stacked semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0978US12300669B2Backside contact for thermal displacement in a multi-wafer stacked integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 1075US11756936B2Backside contact to improve thermal dissipation away from semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·0 cites·20 claims
- 1175US2025149509A1Backside contact to improve thermal dissipation away from semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1273US2025070092A1Shared pad/bridge layout for a 3d icTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1371US11694997B2Backside contact for thermal displacement in a multi-wafer stacked integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 4, 2023·0 cites·20 claims
- 1470US12469817B2Support structure to reinforce stacked semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·20 claims
- 1570US12278151B2Semiconductor wafer seal ring having protrusion extending into trench in semiconductor substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 15, 2025·0 cites·20 claims
- 1669US11289455B2Backside contact to improve thermal dissipation away from semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 29, 2022·0 cites·20 claims
- 1768US2025210427A1Semiconductor wafer seal ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1853US2023373018A1Dual blade configuration for wafer edge trimming processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1951US2024153895A1Semiconductor die packages and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →