Inventor · disambiguated record
Pierric Gueguen
Also filed as: GUEGUEN PIERRIC
6 granted patents·35 citations·filing 2009–2019
78Inventor score
Top patents by PatentIndex Score
6 records- 0189US9027821B2Process for direct bonding two elements comprising copper portions and portions of dielectric materialsDI CIOCCIO LEA·Filed 2011·Granted May 12, 2015·15 cites·18 claims
- 0287US8647983B2Simplified copper-copper bondingDI CIOCCIO LEA·Filed 2010·Granted Feb 11, 2014·12 cites·15 claims
- 0376US10910782B2Treatment, before the bonding of a mixed Cu-oxide surface, by a plasma containing nitrogen and hydrogenVANDROUX LAURENT·Filed 2011·Granted Feb 2, 2021·7 cites·13 claims
- 0460US9620412B2Method for modifying the crystalline structure of a copper elementDI CIOCCIO LEA·Filed 2010·Granted Apr 11, 2017·1 cites·11 claims
- 0548US11735377B2Protection device for an electrical circuit, electrical circuit equipped with such a device and method for protecting such an electrical circuitMERSEN FRANCE SB SAS·Filed 2019·Granted Aug 22, 2023·0 cites·10 claims
- 0642US8642391B2Self-assembly of chips on a substrateDI CIOCCIO LEA·Filed 2009·Granted Feb 4, 2014·0 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →