Inventor · disambiguated record
Ping-Cheng Hu
Also filed as: HU PING · HU PING-CHENG
11 granted patents·2 pending applications·158 citations·filing 2008–2014
91Inventor score
Files withCHANG CHIEN PAO-HUEI5ADVANCED SEMICONDUCTOR ENG3BOE TECHNOLOGY GROUP CO LTD1CHEN CHIEN-WEN1CHIANG PO-SHING1
Top patents by PatentIndex Score
13 records- 0193US8120152B2Advanced quad flat no lead chip package having marking and corner lead features and manufacturing methods thereofCHANG CHIEN PAO-HUEI·Filed 2008·Granted Feb 21, 2012·26 cites·24 claims
- 0290US8115285B2Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereofCHEN CHIEN-WEN·Filed 2008·Granted Feb 14, 2012·22 cites·27 claims
- 0389US8106492B2Semiconductor package and manufacturing method thereofCHANG CHIEN PAO-HUEI·Filed 2009·Granted Jan 31, 2012·25 cites·21 claims
- 0488US8124447B2Manufacturing method of advanced quad flat non-leaded packageCHANG CHIEN PAO-HUEI·Filed 2009·Granted Feb 28, 2012·24 cites·29 claims
- 0587US8237250B2Advanced quad flat non-leaded package structure and manufacturing method thereofCHANG CHIEN PAO-HUEI·Filed 2009·Granted Aug 7, 2012·21 cites·20 claims
- 0683US8492883B2Semiconductor package having a cavity structureCHIEN PAO-HUEI CHANG·Filed 2008·Granted Jul 23, 2013·17 cites·37 claims
- 0781US8502363B2Semiconductor device packages with solder joint enhancement element and related methodsCHIANG PO-SHING·Filed 2012·Granted Aug 6, 2013·8 cites·20 claims
- 0880US8674487B2Semiconductor packages with lead extensions and related methodsYU LIN-WANG·Filed 2012·Granted Mar 18, 2014·12 cites·18 claims
- 0970US9059379B2Light-emitting semiconductor packages and related methodsADVANCED SEMICONDUCTOR ENG·Filed 2012·Granted Jun 16, 2015·3 cites·19 claims
- 1053US9563081B2Frame seal structure on substrate, substrate, and liquid crystal display deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2014·Granted Feb 7, 2017·0 cites·11 claims
- 1151US8994156B2Semiconductor device packages with solder joint enhancement elementsADVANCED SEMICONDUCTOR ENG·Filed 2013·Granted Mar 31, 2015·0 cites·16 claims
- 1249US2010044850A1Advanced quad flat non-leaded package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2009·Application pending·0 cites
- 1335US2012119342A1Advanced quad flat non-leaded package structure and manufacturing method thereofCHANG CHIEN PAO-HUEI·Filed 2010·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Ping-Cheng Hu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →