Inventor · disambiguated record
Pil Joong Kang
Also filed as: KANG PIL JOONG
9 granted patents·20 pending applications·3 citations·filing 2008–2017
76Inventor score
Top patents by PatentIndex Score
29 records- 0180US9842787B2Electronic element package and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Dec 12, 2017·3 cites·12 claims
- 0252US10068820B2Electronic element package and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Sep 4, 2018·0 cites·5 claims
- 0351US8944566B2Inkjet print headSAMSUNG ELECTRO MECH·Filed 2012·Granted Feb 3, 2015·0 cites·16 claims
- 0450US2011057991A1Inkjet head and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 0548US8777378B2Piezoelectric actuator, inkjet head assembly and method of manufacturing the sameLEE TAE KYUNG·Filed 2012·Granted Jul 15, 2014·0 cites·14 claims
- 0648US8192640B2Method of manufacturing ink-jet headKIM SANG-JIN·Filed 2009·Granted Jun 5, 2012·0 cites·6 claims
- 0747US10749098B2Electronic element package and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Aug 18, 2020·0 cites·19 claims
- 0846US10211808B2Acoustic wave filter device and package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Feb 19, 2019·0 cites·24 claims
- 0943US2010096081A1Method of manufacturing ink-jet headSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1043US2010097424A1Ink-jet headSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1143US2010097738A1Electrostatic chuck and substrate bonding device using the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1242US2015110309A1Acoustic transducer and package module including the sameUNIV TOHOKU·Filed 2014·Application pending·0 cites
- 1341US10418179B2Multilayer thin-film capacitorSAMSUNG ELECTRO MECH·Filed 2017·Granted Sep 17, 2019·0 cites·15 claims
- 1441US10298204B2Acoustic wave filter device, package to manufacture acoustic wave filter device, and method to manufacture acoustic wave filter deviceSAMSUNG ELECTRO MECH·Filed 2016·Granted May 21, 2019·0 cites·11 claims
- 1541US2008266365A1Ink-jet headSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1641US2008266360A1Ink-jet head and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1740US2010073436A1Ink-jet headSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1839US2013169723A1Inkjet print headSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 1939US2014078225A1Inkjet print headSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2038US2013342610A1Piezoelectric actuator, inkjet head assembly and method of manufacturing the sameLEE TAE KYUNG·Filed 2012·Application pending·0 cites
- 2137US2013286107A1Inkjet print headSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2236US2015355220A1Inertial sensor module having hermetic seal formed of metal and multi-axis sensor employing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 2336US2015355219A1Multi-axis sensorSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 2434US2016054352A1Multi-axis sensor and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 2533US2011254900A1Inkjet head assembly and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2011·Application pending·0 cites
- 2632US2017179919A1Acoustic resonator and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 2732US2011316941A1Ink path structure and inkjet head including the sameSHIN HYUN HO·Filed 2011·Application pending·0 cites
- 2832US2011265297A1Method of manufacturing inkjet headSAMSUNG ELECTRO MECH·Filed 2011·Application pending·0 cites
- 2932US2011063368A1Multi inkjet head package, inkjet recording apparatus using the same, and method of aligning the same in inkjet recording apparatusSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →