Inventor · disambiguated record
Pi-Cheng Law
Also filed as: LAW PI-CHENG
11 granted patents·5 pending applications·52 citations·filing 2015–2022
87Inventor score
Top patents by PatentIndex Score
16 records- 0198US11817676B2Small form factor transmitting deviceMARVELL ASIA PTE LTD·Filed 2022·Granted Nov 14, 2023·3 cites·11 claims
- 0298US9548817B1Small form factor transmitting deviceINPHI CORP·Filed 2015·Granted Jan 17, 2017·40 cites·14 claims
- 0388US10892598B2Small form factor transmitting deviceINPHI CORP·Filed 2019·Granted Jan 12, 2021·2 cites·19 claims
- 0486US9887516B2Small form factor transmitting deviceINPHI CORP·Filed 2016·Granted Feb 6, 2018·2 cites·38 claims
- 0584US11355900B2Small form factor transmitting deviceMARVELL ASIA PTE LTD·Filed 2020·Granted Jun 7, 2022·1 cites·20 claims
- 0684US10559941B2Small form factor transmitting deviceINPHI CORP·Filed 2018·Granted Feb 11, 2020·2 cites·19 claims
- 0783US10141717B2Small form factor transmitting deviceINPHI CORP·Filed 2017·Granted Nov 27, 2018·2 cites·20 claims
- 0852US11374382B2Method for increasing EAM bandwidth, component structure and manufacturing process thereof using plural p-i-n waveguides serially connected by high-impedance transmission linesLUXNET CORP·Filed 2020·Granted Jun 28, 2022·0 cites·12 claims
- 0946US10656355B2Heat dissipation structure of horizontal optical-communication sub-assemblyLUXNET CORP·Filed 2019·Granted May 19, 2020·0 cites·20 claims
- 1042US9991674B2Optical transmitter with a heat dissipation structureLUXNET CORP·Filed 2016·Granted Jun 5, 2018·0 cites·19 claims
- 1135US9847307B1Two-end driving, high-frequency sub-substrate structure and high-frequency transmission structure including the sameLUXNET CORP·Filed 2017·Granted Dec 19, 2017·0 cites·20 claims
- 1235US2018188457A1Optical communication module configured for enhancing optical coupling efficiencyLUXNET CORP·Filed 2017·Application pending·0 cites
- 1332US2018188458A1Optical communication module configured for enhancing optical coupling efficiencyLUXNET CORP·Filed 2017·Application pending·0 cites
- 1431US2018190520A1Composite heat-dissipating substrateLUXNET CORP·Filed 2017·Application pending·0 cites
- 1531US2018248336A1Assembly of semiconductor and highly thermally conductive heat-dissipating substratesLUXNET CORP·Filed 2018·Application pending·0 cites
- 1630US2018191131A1Heat-dissipating semiconductor assemblyLUXNET CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →