Inventor · disambiguated record
Pierre Leroux
Also filed as: LEROUX PIERRE · LEROUX PIERRE J
34 granted patents·4 pending applications·478 citations·filing 1973–2018
97Inventor score
Top patents by PatentIndex Score
38 records- 0190US5902703AMethod for measuring dimensional anomalies in photolithographed integrated circuits using overlay metrology, and masks thereforVLSI TECHNOLOGY INC·Filed 1997·Granted May 11, 1999·97 cites·22 claims
- 0282US5407785AMethod for generating dense lines on a semiconductor wafer using phase-shifting and multiple exposuresVLSI TECHNOLOGY INC·Filed 1992·Granted Apr 18, 1995·40 cites·1 claims
- 0380US5962173AMethod for measuring the effectiveness of optical proximity correctionsVLSI TECHNOLOGY INC·Filed 1997·Granted Oct 5, 1999·50 cites·26 claims
- 0477US8281648B2Material testing apparatus with non-contact sensorLEROUX PIERRE·Filed 2008·Granted Oct 9, 2012·7 cites·20 claims
- 0574US6301008B1Arrangement and method for calibrating optical line shortening measurementsPHILIPS SEMICONDUCTOR INC·Filed 1999·Granted Oct 9, 2001·33 cites·23 claims
- 0671US7709166B2Measuring the effect of flare on line widthNXP BV·Filed 2009·Granted May 4, 2010·2 cites·13 claims
- 0770US6800403B2Techniques to characterize iso-dense effects for microdevice manufactureKONINKL PHILIPS ELECTRONICS NV·Filed 2002·Granted Oct 5, 2004·8 cites·12 claims
- 0868US5976741AMethods for determining illumination exposure dosageVSLI TECHNOLOGY INC·Filed 1997·Granted Nov 2, 1999·26 cites·43 claims
- 0967US7054007B2Calibration wafer for a stepperKONINKL PHILIPS ELECTRONICS NV·Filed 2002·Granted May 30, 2006·7 cites·7 claims
- 1064US7556893B2Self-compensating mark design for stepper alignmentNXP BV·Filed 2006·Granted Jul 7, 2009·1 cites·13 claims
- 1164US5960107AMethod for verifying an average topography height function of a photostepperVLSI TECHNOLOGY INC·Filed 1995·Granted Sep 28, 1999·25 cites·7 claims
- 1261US7067931B1Self-compensating mark design for stepper alignmentKONINKL PHILIPS ELECTRONICS NV·Filed 2000·Granted Jun 27, 2006·5 cites·7 claims
- 1360US6465322B2Semiconductor processing methods and structures for determining alignment during semiconductor wafer processingKONINKL PHILIPS ELECTRONICS NV·Filed 1998·Granted Oct 15, 2002·21 cites·49 claims
- 1459US5780208AMethod and mask design to minimize reflective notching effectsVLSI TECHNOLOGY INC·Filed 1996·Granted Jul 14, 1998·18 cites·6 claims
- 1559US5350428AElectrostatic apparatus and method for removing particles from semiconductor wafersVLSI TECHNOLOGY INC·Filed 1993·Granted Sep 27, 1994·31 cites·33 claims
- 1654US5876883AMethod forming focus/exposure matrix on a wafer using overlapped exposuresVLSI TECHNOLOGY INC·Filed 1995·Granted Mar 2, 1999·13 cites·5 claims
- 1751US6541283B1Method for determining magnification error portion of total misalignment error in a stepperKONINKL PHILIPS ELECTRONICS NV·Filed 1999·Granted Apr 1, 2003·12 cites·11 claims
- 1851US5392113ASemiconductor wafer defect monitoringVLSI TECHNOLOGY INC·Filed 1992·Granted Feb 21, 1995·17 cites·21 claims
- 1948US5856052AWafer with a focus/exposure matrixVLSI TECHNOLOGY INC·Filed 1997·Granted Jan 5, 1999·9 cites·8 claims
- 2047US7868473B2Wafer target design and method for determining centroid of wafer targetNXP BV·Filed 2005·Granted Jan 11, 2011·0 cites·20 claims
- 2147US7332255B2Overlay box structure for measuring process induced line shortening effectNXP BV·Filed 2004·Granted Feb 19, 2008·1 cites·15 claims
- 2247US6544859B2Semiconductor processing methods and structures for determining alignment during semiconductor wafer processingKONINKL PHILIPS ELECTRONICS NV·Filed 2001·Granted Apr 8, 2003·3 cites·5 claims
- 2347US6258611B1Method for determining translation portion of misalignment error in a stepperVLSI TECHNOLOGY INC·Filed 1999·Granted Jul 10, 2001·10 cites·12 claims
- 2446US7442474B2Reticle for determining rotational errorNXP BV·Filed 2005·Granted Oct 28, 2008·0 cites·14 claims
- 2546US5830610AMethod for measuring alignment accuracy in a step and repeat system utilizing different intervalsVLSI TECHNOLOGY INC·Filed 1996·Granted Nov 3, 1998·9 cites·28 claims
- 2645US6889162B1Wafer target design and method for determining centroid of wafer targetKONINKL PHILIPS ELECTRONICS NV·Filed 2000·Granted May 3, 2005·1 cites·14 claims
- 2744US7556900B2Measuring the effect of flare on line widthNXP BV·Filed 2004·Granted Jul 7, 2009·0 cites·3 claims
- 2844US6671048B1Method for determining wafer misalignment using a pattern on a fine alignment targetKONINKL PHILIPS ELECTRONICS NV·Filed 1999·Granted Dec 30, 2003·8 cites·21 claims
- 2944US2006033917A1Calibration wafer for a stepperLEROUX PIERRE·Filed 2005·Application pending·0 cites
- 3043US6950187B2Method for determining rotational error portion of total misalignment error in a stepperKONINKL PHILIPS ELECTRONICS NV·Filed 2003·Granted Sep 27, 2005·0 cites·24 claims
- 3142US6639676B1Method for determining rotational error portion of total misalignment error in a stepperKONINKL PHILIPS ELECTRONICS NV·Filed 1999·Granted Oct 28, 2003·6 cites·12 claims
- 3238US10274312B23d surface scanning white light axial chromatism deviceNANOVEA INC·Filed 2018·Granted Apr 30, 2019·0 cites·20 claims
- 3338US5762688AParticle removal waferVLSI TECHNOLOGY INC·Filed 1996·Granted Jun 9, 1998·6 cites·8 claims
- 3436US5972051AMethod and apparatus for removing particles from semiconductor wafer edges using a particle withdrawing meansVLSI TECHNOLOGY INC·Filed 1994·Granted Oct 26, 1999·9 cites·22 claims
- 3530US2014298897A1High speed nano wear testing apparatusNANOVEA INC·Filed 2013·Application pending·0 cites
- 3626US3947305ABuilding a lamination of fiberglass reinforced polyester resin on a rotating mandrelSTANDARD OIL CO OHIO·Filed 1973·Granted Mar 30, 1976·3 cites·5 claims
- 3721US2016282249A1Method for calculating an indenter area function and quantifying a deviation from the ideal shape of an indenterNANOVEA INC·Filed 2015·Application pending·0 cites
- 3821US2016334315A1Method for automated parameter and selection testing based on known characteristics of the sample being testedNANOVEA INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →