Inventor · disambiguated record
Ping Liou
Also filed as: LIOU PING · LIOU PING-CHIH
11 granted patents·2 pending applications·459 citations·filing 1998–2005
92Inventor score
Top patents by PatentIndex Score
13 records- 0193US6037649AThree-dimension inductor structure in integrated circuit technologyWINBOND ELECTRONICS CORP·Filed 1999·Granted Mar 14, 2000·178 cites·9 claims
- 0290US6420773B1Multi-level spiral inductor structure having high inductance (L) and high quality factor (Q)WINBOND ELECTRONICS CORP·Filed 2000·Granted Jul 16, 2002·68 cites·11 claims
- 0388US7067350B1Method of manufacturing a semiconductor device using electrical contacts formed in an isolation layerTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Jun 27, 2006·19 cites·13 claims
- 0486US6355535B2Method and structure of manufacturing a high-Q inductor with an air trenchWINBOND ELECTRONICS CORP·Filed 2001·Granted Mar 12, 2002·42 cites·11 claims
- 0585US6459117B1Integrated circuit device formed with high Q MIM capacitorWINBOND ELECTRONICS CORP·Filed 2001·Granted Oct 1, 2002·30 cites·11 claims
- 0679US6326673B1Method and structure of manufacturing a high-Q inductor with an air trenchWINDBOND ELECTRONICS CORP·Filed 1999·Granted Dec 4, 2001·51 cites·6 claims
- 0775US6426267B2Method for fabricating high-Q inductance device in monolithic technologyWINBOND ELECTRONICS CORP·Filed 2001·Granted Jul 30, 2002·21 cites·17 claims
- 0857US6472285B1Method for fabricating high-Q inductance device in monolithic technologyWINBOND ELECTRONICS CORP·Filed 1999·Granted Oct 29, 2002·17 cites·8 claims
- 0957US6251788B1Method of integrated circuit polishing without dishing effectsWINBOND ELECTRONICS CORP·Filed 1999·Granted Jun 26, 2001·22 cites·9 claims
- 1046US6620678B2Integrated circuit device formed with high Q MIM capacitorWINBOND ELECTRONICS CORP·Filed 2002·Granted Sep 16, 2003·1 cites·19 claims
- 1142US2003082007A1Assembled sluice gate for flood-prevention and water-blockingFiled 2002·Application pending·0 cites
- 1236US6150274AMethod of enhancing CMP removal rate of polymer-like material and improving planarization in integrated circuit structureWINBOND ELECTRONICS CORP·Filed 1999·Granted Nov 21, 2000·10 cites·8 claims
- 1322US2002008301A1Monolithic high-q inductance device and process for fabricating the sameFiled 1998·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →