Inventor · disambiguated record
Pilin Liu
Also filed as: LIU PILIN
4 granted patents·4 pending applications·14 citations·filing 2008–2022
70Inventor score
Top patents by PatentIndex Score
8 records- 0188US11387175B2Interposer package-on-package (PoP) with solder array thermal contactsINTEL CORP·Filed 2018·Granted Jul 12, 2022·6 cites·16 claims
- 0280US10361167B2Electronic assembly using bismuth-rich solderINTEL CORP·Filed 2015·Granted Jul 23, 2019·4 cites·17 claims
- 0368US8013444B2Solder joints with enhanced electromigration resistanceINTEL CORP·Filed 2008·Granted Sep 6, 2011·4 cites·5 claims
- 0449US2023317676A1Bond head design for thermal compression bondingINTEL CORP·Filed 2022·Application pending·0 cites
- 0549US2023317675A1Non-planar pedestal for thermal compression bondingINTEL CORP·Filed 2022·Application pending·0 cites
- 0645US8759974B2Solder joints with enhanced electromigration resistancePANG MENGZHI·Filed 2011·Granted Jun 24, 2014·0 cites·13 claims
- 0741US2015255414A1Solder alloy to enhance reliability of solder interconnects with nipdau or niau surface finishes during high temperature exposureLIU PILIN·Filed 2014·Application pending·0 cites
- 0832US2017059303A1Nondestructive optical detection of trace undercut, width and thicknessMAY ROBERT ALAN·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →