Inventor · disambiguated record
Pi-Yu Peng
Also filed as: PENG PI-YU
3 granted patents·1 pending application·0 citations·filing 2022–2025
40Inventor score
Files withCHIPBOND TECHNOLOGY CORP4
Top patents by PatentIndex Score
4 records- 0177US2025393118A1Flip-chip bonding structure and circuit board thereofCHIPBOND TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 0266US12432849B2Flip-chip bonding structure and circuit board thereofCHIPBOND TECHNOLOGY CORP·Filed 2023·Granted Sep 30, 2025·0 cites·10 claims
- 0353US12456673B2Flip chip package and substrate thereofCHIPBOND TECHNOLOGY CORP·Filed 2023·Granted Oct 28, 2025·0 cites·17 claims
- 0446US11764090B2TrayCHIPBOND TECHNOLOGY CORP·Filed 2022·Granted Sep 19, 2023·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →