Inventor · disambiguated record
Pin Jan Wang
Also filed as: WANG PIN · WANG PIN JAN
0 granted patents·3 pending applications·0 citations·filing 2023–2024
Files withINTEL CORP3
Top patents by PatentIndex Score
3 records- 0162US2025385168A1Localized thinned board for bottom side component integrationINTEL CORP·Filed 2024·Application pending·0 cites
- 0260US2025311180A1Electromagnetic interference shield extending underneath memory modulesINTEL CORP·Filed 2024·Application pending·0 cites
- 0353US2025008661A1Deflection spring compression mountingINTEL CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →