Inventor · disambiguated record
Ping-Feng Yang
Also filed as: YANG PING · YANG PING-FENG
14 granted patents·5 pending applications·65 citations·filing 2001–2024
90Inventor score
Top patents by PatentIndex Score
19 records- 0194US9069782B2System and method for security and privacy aware virtual machine checkpointingUNIV NEW YORK STATE RES FOUND·Filed 2013·Granted Jun 30, 2015·26 cites·18 claims
- 0293US11409619B2Recovering a virtual machine after failure of post-copy live migrationUNIV NEW YORK STATE RES FOUND·Filed 2021·Granted Aug 9, 2022·8 cites·20 claims
- 0391US9552495B2System and method for security and privacy aware virtual machine checkpointingUNIV NEW YORK STATE RES FOUND·Filed 2015·Granted Jan 24, 2017·8 cites·20 claims
- 0484US11983079B2Recovering a virtual machine after failure of post-copy live migrationUNIV NEW YORK STATE RES FOUND·Filed 2022·Granted May 14, 2024·1 cites·20 claims
- 0581US9953930B1Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Apr 24, 2018·5 cites·18 claims
- 0680US10181448B2Semiconductor devices and semiconductor packagesADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Jan 15, 2019·3 cites·21 claims
- 0779US10324795B2System and method for security and privacy aware virtual machine checkpointingUNIV NEW YORK STATE RES FOUND·Filed 2017·Granted Jun 18, 2019·2 cites·20 claims
- 0878US9443813B1Semiconductor device and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Sep 13, 2016·3 cites·12 claims
- 0973US2025077362A1Recovering a virtual machine after failure of post-copy live migrationUNIV NEW YORK STATE RES FOUND·Filed 2024·Application pending·0 cites
- 1063US6549109B1Magnet-sensible triggering doorbell mechanismFiled 2001·Granted Apr 15, 2003·9 cites·2 claims
- 1158US10658319B2Semiconductor devices and semiconductor packagesADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted May 19, 2020·0 cites·20 claims
- 1251US2019214323A1Filler compositions and underfill compositions and molding compounds including the same for preparing semiconductor packagesADVANCED SEMICONDUCTOR ENG·Filed 2019·Application pending·0 cites
- 1350US10818517B2Semiconductor package structure and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Oct 27, 2020·0 cites·20 claims
- 1448US9960136B2Semiconductor device and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted May 1, 2018·0 cites·13 claims
- 1544US2017141007A1Filler compositions and underfill compositions and molding compounds including the same for preparing semiconductor packagesADVANCED SEMICONDUCTOR ENG·Filed 2015·Application pending·0 cites
- 1640US2021327731A1Mass transfer method, mass transfer device and buffer carrierADVANCED SEMICONDUCTOR ENG·Filed 2020·Application pending·0 cites
- 1739US9741675B2Bump structures, semiconductor device and semiconductor device package having the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Aug 22, 2017·0 cites·13 claims
- 1835US11075186B2Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jul 27, 2021·0 cites·23 claims
- 1935US2012119342A1Advanced quad flat non-leaded package structure and manufacturing method thereofCHANG CHIEN PAO-HUEI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →