Inventor · disambiguated record
Ping-Sheng Yeh
Also filed as: YEH PING SHENG
12 granted patents·2 pending applications·26 citations·filing 2014–2025
86Inventor score
Top patents by PatentIndex Score
14 records- 0189US12031363B2Handle mechanism and casing assembly including the sameWIWYNN CORP·Filed 2021·Granted Jul 9, 2024·3 cites·20 claims
- 0285US10912221B2Detachable carrier and related server apparatusWIWYNN CORP·Filed 2018·Granted Feb 2, 2021·4 cites·19 claims
- 0385US10537040B1ChassisWIWYNN CORP·Filed 2019·Granted Jan 14, 2020·4 cites·10 claims
- 0477US10790099B2Electronic device with switch button module and switch button module thereofWIWYNN CORP·Filed 2018·Granted Sep 29, 2020·2 cites·14 claims
- 0573US9699925B2Assembly structure and electronic device thereofWISTRON CORP·Filed 2016·Granted Jul 4, 2017·2 cites·20 claims
- 0670US10042389B2Carrying structure for carrying electronic deviceWISTRON CORP·Filed 2014·Granted Aug 7, 2018·3 cites·16 claims
- 0768US10964353B2Electronic device with detachable structure and module frame thereofWIWYNN CORP·Filed 2019·Granted Mar 30, 2021·1 cites·11 claims
- 0868US2025344313A1Chipset assembly with anti-tilt mechanism and assembling method thereofWIWYNN CORP·Filed 2025·Application pending·0 cites
- 0967US9027896B2Support bracketWISTRON CORP·Filed 2014·Granted May 12, 2015·4 cites·15 claims
- 1062US10032054B2Rotatable assembly and scanning device including the sameWISTRON CORP·Filed 2015·Granted Jul 24, 2018·3 cites·20 claims
- 1156US11797226B2Solid state disk deviceWIWYNN CORP·Filed 2021·Granted Oct 24, 2023·0 cites·8 claims
- 1252US2024381561A1Expansion card frame assembly, expansion card module and electronic deviceWIWYNN CORP·Filed 2023·Application pending·0 cites
- 1343US9281856B2Support base for electronic deviceWISTRON CORP·Filed 2014·Granted Mar 8, 2016·0 cites·16 claims
- 1439US9442532B2Portable electronic device and cover mechanism thereofWISTRON CORP·Filed 2015·Granted Sep 13, 2016·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →