Inventor · disambiguated record
Ping-Lung Yu
Also filed as: YU PING · YU PING-LUNG
5 granted patents·7 pending applications·31 citations·filing 2013–2025
72Inventor score
Top patents by PatentIndex Score
12 records- 0182US11742383B2Semiconductor device with air gapWINBOND ELECTRONICS CORP·Filed 2022·Granted Aug 29, 2023·1 cites·20 claims
- 0277USD764484SWatch with three display screens with graphical user interfaceHUAWEI DEVICE CO LTD·Filed 2013·Granted Aug 23, 2016·29 cites·1 claims
- 0374US2025329532A1Semiconductor structureWINBOND ELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0473US11322623B2Non-volatile memory structure and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2020·Granted May 3, 2022·1 cites·14 claims
- 0570US12374549B2Method of forming semiconductor structureWINBOND ELECTRONICS CORP·Filed 2022·Granted Jul 29, 2025·0 cites·16 claims
- 0656US11417727B2Semiconductor device with air gap and method of fabricating the sameWINBOND ELECTRONICS CORP·Filed 2021·Granted Aug 16, 2022·0 cites·3 claims
- 0755US2025311309A1Flash memory device and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0852US2025126189A1Packet load balancerINTEL CORP·Filed 2024·Application pending·0 cites
- 0950US2023420255A1Method of manufacturing semiconductor deviceWINBOND ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1048US2024222191A1Semiconductor structure and method of forming the sameWINBOND ELECTRONICS CORP·Filed 2022·Application pending·0 cites
- 1146US2024204049A1Memory device and method of fabricating the sameWINBOND ELECTRONICS CORP·Filed 2022·Application pending·0 cites
- 1243US2025357201A1Semiconductor structure and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →