Inventor · disambiguated record
Pierino I. Zappella
Also filed as: ZAPPELLA PIERINO I · ZAPPELLA PIERINO ITALO
6 granted patents·2 pending applications·266 citations·filing 1989–2004
87Inventor score
Top patents by PatentIndex Score
8 records- 0179US5151389AMethod for dicing semiconductor substrates using an excimer laser beamROCKWELL INTERNATIONAL CORP·Filed 1990·Granted Sep 29, 1992·75 cites·8 claims
- 0278US5440239ATransferable solder bumps for interconnect and assembly of MCM substratesROCKWELL INTERNATIONAL CORP·Filed 1994·Granted Aug 8, 1995·61 cites·20 claims
- 0373US5214261AMethod and apparatus for dicing semiconductor substrates using an excimer laser beamROCKWELL INTERNATIONAL CORP·Filed 1991·Granted May 25, 1993·55 cites·10 claims
- 0473US5091288AMethod of forming detector array contact bumps for improved lift off of excess metalROCKWELL INTERNATIONAL CORP·Filed 1989·Granted Feb 25, 1992·50 cites·17 claims
- 0553US6405429B1Microbeam assembly and associated method for integrated circuit interconnection to substratesHONEYWELL INC·Filed 1999·Granted Jun 18, 2002·14 cites·24 claims
- 0643US6297069B1Method for supporting during fabrication mechanical members of semi-conductive dies, wafers, and devices and an associated intermediate device assemblyHONEYWELL INC·Filed 1999·Granted Oct 2, 2001·11 cites·21 claims
- 0737US2005048696A1Microbeam assembly and associated method for integrated circuit interconnection to substratesHONEYWELL INC·Filed 2004·Application pending·0 cites
- 0834US2002036100A1Microbeam assembly for integrated circuit interconnection to substratesHONEYWELL INC·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →