Inventor · disambiguated record
Po-Zen Chen
Also filed as: CHEN PO-ZEN
29 granted patents·11 pending applications·85 citations·filing 2002–2024
95Inventor score
Top patents by PatentIndex Score
40 records- 0194US11430909B2BSI chip with backside alignment markTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 30, 2022·3 cites·20 claims
- 0293US7829815B2Adjustable electrodes and coils for plasma density distribution controlTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Nov 9, 2010·25 cites·38 claims
- 0391US9484376B2Semiconductor isolation structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 1, 2016·8 cites·11 claims
- 0489US11532658B2Image sensor grid and method of fabrication of sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·2 cites·20 claims
- 0589US7588946B2Controlling system for gate formation of semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Sep 15, 2009·29 cites·20 claims
- 0688US10269684B2Semiconductor structure and manufacuting method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·4 cites·20 claims
- 0785US2025126920A1Image sensor device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0884US10163646B2Method for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·1 cites·19 claims
- 0980US12261188B2Image sensor device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 1080US9583356B1Method for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 28, 2017·1 cites·20 claims
- 1180US8803271B2Structures for grounding metal shields in backside illumination image sensor chipsLIU ZHE-JU·Filed 2012·Granted Aug 12, 2014·4 cites·20 claims
- 1280US2024047496A1Image sensor grid and method of fabrication of sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1378US10879289B1Method for forming a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·2 cites·20 claims
- 1478US2024363791A1Bsi chip with backside alignment markTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1577US12191338B2Image sensor device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 7, 2025·0 cites·20 claims
- 1676US10665466B2Method for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 26, 2020·0 cites·20 claims
- 1776US2023120006A1Image sensor grid and method of fabrication of sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1875US12094997B2BSI chip with backside alignment markTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 17, 2024·0 cites·20 claims
- 1974US2022359598A1Image sensor grid and method of fabrication of sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2072US2024395642A1Test structure for void and topography monitoring in a flash memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2171US2024387146A1Wafer treatment system and method of treating waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2270US11652133B2Image sensor grid and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG·Filed 2021·Granted May 16, 2023·0 cites·20 claims
- 2370US11652127B2Image sensor device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 16, 2023·0 cites·20 claims
- 2468US2022367559A1Method for forming image sensor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2567US9831154B2Semiconductor structure and manufacuting method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 28, 2017·1 cites·20 claims
- 2667US2025370238A1Semiconductor inspection tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2766US11069740B2Image sensor grid and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG·Filed 2019·Granted Jul 20, 2021·0 cites·20 claims
- 2866US7563719B2Dual damascene processTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jul 21, 2009·2 cites·14 claims
- 2964US8872301B2Dual profile shallow trench isolation apparatus and systemHUNG CHIA-YANG·Filed 2012·Granted Oct 28, 2014·3 cites·20 claims
- 3062US12444660B2Test structure for void and topography monitoring in a flash memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 14, 2025·0 cites·20 claims
- 3162US10658269B2Semiconductor structure and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 19, 2020·0 cites·20 claims
- 3259US11502123B2Methods for forming image sensor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 15, 2022·0 cites·20 claims
- 3359US10056316B2Manufacuting method of semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 21, 2018·0 cites·20 claims
- 3458US12183550B2Wafer treatment system and method of treating waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 31, 2024·0 cites·20 claims
- 3558US2024404832A1Wet tool kit for forming semiconductor structure and cmos image sensor employing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3657US10811423B2Method of fabricating semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 20, 2020·0 cites·20 claims
- 3752US10269814B2Method of fabricating semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 23, 2019·0 cites·11 claims
- 3844US11164903B2Image sensor with pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 2, 2021·0 cites·20 claims
- 3938US2004054642A1System for decoding and searching content of file and operation method thereofFiled 2002·Application pending·0 cites
- 4036US10008530B2Image sensing device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 26, 2018·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →