Inventor · disambiguated record
Poh Boon Khoo
Also filed as: KHOO POH BOON
7 granted patents·14 pending applications·3 citations·filing 2019–2025
75Inventor score
Files withINTEL CORP21
Top patents by PatentIndex Score
21 records- 0189US2025336810A1Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridgeINTEL CORP·Filed 2025·Application pending·0 cites
- 0287US11205613B2Organic mold interconnects in shielded interconnects frames for integrated-circuit packagesINTEL CORP·Filed 2020·Granted Dec 21, 2021·2 cites·23 claims
- 0383US12400952B2Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridgeINTEL CORP·Filed 2023·Granted Aug 26, 2025·0 cites·20 claims
- 0477US11908793B2Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridgeINTEL CORP·Filed 2022·Granted Feb 20, 2024·0 cites·22 claims
- 0575US10998262B2Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridgeINTEL CORP·Filed 2019·Granted May 4, 2021·1 cites·23 claims
- 0673US11658111B2Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridgeINTEL CORP·Filed 2021·Granted May 23, 2023·0 cites·20 claims
- 0769US11699644B2Organic mold interconnects in shielded interconnects frames for integrated-circuit packagesINTEL CORP·Filed 2021·Granted Jul 11, 2023·0 cites·16 claims
- 0857US2025096154A1Package Substrates with Stiffener InterposersINTEL CORP·Filed 2023·Application pending·0 cites
- 0955US2025006666A1Microstrip routing on embedded high-k dielectricINTEL CORP·Filed 2023·Application pending·0 cites
- 1055US2024355792A1Reversed overhang memory on package (mop) architectureINTEL CORP·Filed 2023·Application pending·0 cites
- 1155US2025107003A1Methods and apparatus to manage noise for timing circuitryINTEL CORP·Filed 2023·Application pending·0 cites
- 1255US2025006588A1Passive cooling heat spreader with phase change material infused meshINTEL CORP·Filed 2023·Application pending·0 cites
- 1354US2025113428A1Technologies for an electromagnetic interference shieldINTEL CORP·Filed 2023·Application pending·0 cites
- 1453US2024290680A1Low-profile memory apparatus compatible with system thermal solutions and method for making sameINTEL CORP·Filed 2023·Application pending·0 cites
- 1553US2024106139A1Connector to electrically couple multiple substratesINTEL CORP·Filed 2022·Application pending·0 cites
- 1653US2024113033A1Dynamic random-access memory in a molding beneath a dieINTEL CORP·Filed 2022·Application pending·0 cites
- 1752US2024145394A1Interposer power corridorINTEL CORP·Filed 2022·Application pending·0 cites
- 1851US11322434B2Top-to-bottom interconnects with molded lead-frame module for integrated-circuit packagesINTEL CORP·Filed 2020·Granted May 3, 2022·0 cites·23 claims
- 1951US2024071948A1Semiconductor package with stiffener basket portionINTEL CORP·Filed 2022·Application pending·0 cites
- 2051US2023369232A1Molded interconnect memory on packageINTEL CORP·Filed 2022·Application pending·0 cites
- 2151US2023397323A1Package bottom side thermal solution with discrete hat-shaped copper spreader componentINTEL CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →