Inventor · disambiguated record
Po-Chen Lai
Also filed as: LAI PO-CHEN
51 granted patents·46 pending applications·19 citations·filing 2019–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD94FAR EASTERN NEW CENTURY CORP2TAIWAN SEMICONDUCTOR MFG COPMPANY LTD1
Top patents by PatentIndex Score
97 records- 0197US11967582B2Multi-chip device and method of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 23, 2024·2 cites·20 claims
- 0297US11637087B2Multi-chip device and method of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 25, 2023·3 cites·20 claims
- 0395US11282756B2Organic interposer including stress-resistant bonding structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 22, 2022·3 cites·20 claims
- 0494US12261102B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 25, 2025·2 cites·16 claims
- 0594US12255156B2Semiconductor package with riveting structure between two rings and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 18, 2025·1 cites·20 claims
- 0694US11915991B2Semiconductor device having first heat spreader and second heat spreader and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 27, 2024·2 cites·20 claims
- 0791US2025364488A1Multi-chip device and method of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0889US2025364346A1Chip package structure with multiple gap-filling layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0988US11676916B2Structure and formation method of package with warpage-control elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 13, 2023·1 cites·20 claims
- 1087US12394752B2Multi-chip device and method of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 19, 2025·0 cites·20 claims
- 1187US11894320B2Semiconductor device package with stress reduction design and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·1 cites·20 claims
- 1287US2025364436A1Methods of forming a semiconductor package including stress buffersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1386US12040285B2Structure and formation method of chip package with reinforcing structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 16, 2024·1 cites·20 claims
- 1486US12014969B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 18, 2024·1 cites·20 claims
- 1586US11742322B2Integrated fan-out package having stress release structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 29, 2023·1 cites·20 claims
- 1684US12362256B2Method for forming semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 1784US11652037B2Semiconductor package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 16, 2023·1 cites·20 claims
- 1883US2025309034A1Method for forming semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1983US2025323106A1Chip package structure with ring structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2083US2025316572A1Solder resist structure to mitigate solder bridge riskTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2182US12374636B2Semiconductor device package with stress reduction designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
- 2282US2025300094A1Semiconductor device package with stress reduction designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2381US12255078B2Semiconductor devices and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 2481US2025364522A1Semiconductor package and methods of manufacturingTAIWAN SEMICONDUCTOR MFG COPMPANY LTD·Filed 2025·Application pending·0 cites
- 2581US2025364366A1Semiconductor package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2681US2025285958A1Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shapeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2781US2025364439A1Semiconductor package and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2880US12512399B2Semiconductor package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 2980US12341091B2Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shapeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 24, 2025·0 cites·20 claims
- 3080US12087705B2Package structure with warpage-control elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
- 3180US2025070050A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3280US2025357302A1Method for forming semiconductor package with variable pillar heightTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3379US12500208B2Integrated fan-out package having stress release structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 16, 2025·0 cites·20 claims
- 3479US12237276B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·11 claims
- 3579US2024347407A1Method for forming chip package structure with multiple gap-filling layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3679US2024387405A1Chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3779US2025253291A1Fabricating method of semiconductor die with tapered sidewall in packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3879US2024387335A1Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3979US2024371792A1Package structure with warpage-control elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4079US2024371829A1Method of forming a semiconductor device package having dummy diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4178US12113033B2Chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 4278US2025336818A1Metal pillars preventing wetting on sidewalls and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4377US12176301B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 4477US11955455B2Embedded stress absorber in packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 9, 2024·0 cites·20 claims
- 4577US2024222247A1Solder resist structure to mitigate solder bridge riskTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4676US12368080B2Chip package structure with ring structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 22, 2025·0 cites·20 claims
- 4776US2024088095A1Fabricating method of semiconductor die with tapered sidewall in packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4876US2025316639A1Semiconductor chip package having underfill material surrounding a fan-out package and contacting a stress buffer structure sidewallTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4976US2024387349A1Chip package structure with dummy viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 5076US2024387317A1Semiconductor packages with thermal lid and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
Showing the top 50 of 97 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Po-Chen Lai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →