Inventor · disambiguated record
Po-Chia Lai
Also filed as: LAI PO-CHIA
18 granted patents·5 pending applications·43 citations·filing 2015–2025
91Inventor score
Top patents by PatentIndex Score
23 records- 0196US10326430B2Low power flip flop circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 18, 2019·15 cites·16 claims
- 0295US11764766B2Flip flop circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 19, 2023·4 cites·20 claims
- 0394US12003239B2Low-power flip flop circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 4, 2024·2 cites·20 claims
- 0494US11025236B1Low-power AOI-based flip-flopTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 1, 2021·6 cites·20 claims
- 0591US10872190B2Method and system for latch-up preventionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 22, 2020·5 cites·20 claims
- 0691US2025364977A1Flip Flop CircuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0789US9513655B1Interface circuit with variable output swing and open termination mode for transmitting signalsOMNIVISION TECH INC·Filed 2015·Granted Dec 6, 2016·8 cites·22 claims
- 0882US12431873B2Low-power flip flop circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 30, 2025·0 cites·20 claims
- 0982US10931264B2Low-power flip flop circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 23, 2021·2 cites·20 claims
- 1082US2024386180A1Method and system for latch-up preventionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1180US12412019B2Method and system for latch-up preventionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 9, 2025·0 cites·20 claims
- 1280US12100730B2Metal-insulator-metal capacitors with thick intermediate electrode layers and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 24, 2024·0 cites·20 claims
- 1379US11151297B2Multiple fin count layout, method, system, and deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 19, 2021·1 cites·20 claims
- 1479US2025267931A1Methods of resistance and capacitance reduction to circuit output nodesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1578US12407336B2Flip flop circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 2, 2025·0 cites·20 claims
- 1678US12407335B2Flip flop circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 2, 2025·0 cites·20 claims
- 1777US2024387609A1Metal-insulator-metal capacitors with thick intermediate electrode layers and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1874US12324228B2Methods of resistance and capacitance reduction to circuit output nodesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 3, 2025·0 cites·20 claims
- 1971US11615227B2Method and system for latch-up preventionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 28, 2023·0 cites·20 claims
- 2070US12074227B2Semiconductor device including deep trench capacitors and via contactsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 27, 2024·0 cites·16 claims
- 2170US11848352B2Metal-insulator-metal capacitors and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 19, 2023·0 cites·20 claims
- 2269US2021175876A1Low-power flip flop circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 2366US11309311B2Methods of resistance and capacitance reduction to circuit output nodesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 19, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →