Inventor · disambiguated record
Po-Ying Lai
Also filed as: LAI PO-YING
2 granted patents·4 pending applications·2 citations·filing 2021–2025
41Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD6
Top patents by PatentIndex Score
6 records- 0191US12272629B2Semiconductor device having an integrated device positioned within a hybrid interposer that includes organic and non-organic materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 8, 2025·2 cites·20 claims
- 0276US2024379516A1Hybrid organic and non-organic interposer with embedded component and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0373US2025246527A1Semiconductor device having an integrated device positioned within a hybrid interposer that includes organic and non-organic materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0466US12494436B2Integrated passive device dies and methods of forming and placement of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 9, 2025·0 cites·20 claims
- 0550US2022406723A1Interposer via interconnect shapes with improved performance characteristics and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 0647US2023137691A1Hybrid organic and non-organic interposer with embedded component in molding structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Po-Ying Lai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →