Inventor · disambiguated record
Po-Wei Lee
Also filed as: LEE PO-WEI
11 granted patents·8 pending applications·109 citations·filing 2003–2025
88Inventor score
Top patents by PatentIndex Score
19 records- 0197US8137697B1Nanoparticles for protein/peptide delivery and delivery means thereofSUNG HSING-WEN·Filed 2009·Granted Mar 20, 2012·40 cites·19 claims
- 0295US7449200B2Nanoparticles for protein/peptide delivery and delivery meansGP MEDICAL INC·Filed 2006·Granted Nov 11, 2008·25 cites·10 claims
- 0391US7901711B1Nanoparticles for protein/peptide delivery and delivery means thereofGP MEDICAL INC·Filed 2007·Granted Mar 8, 2011·10 cites·15 claims
- 0473USD951446SCombined scraping and collecting deviceBIOGEND THERAPEUTICS CO LTD·Filed 2020·Granted May 10, 2022·7 cites·1 claims
- 0572US10256217B2Light emitting deviceTSLC CORP·Filed 2017·Granted Apr 9, 2019·3 cites·13 claims
- 0671US6949979B2Designing methods and circuits for multi-band electronic circuitsUNIV NAT TAIWAN·Filed 2003·Granted Sep 27, 2005·19 cites·12 claims
- 0766US2022131056A1UV LED Package Having Encapsulating Extraction LayerTSLC CORP·Filed 2021·Application pending·0 cites
- 0865USD1041657SMedical implant setBIOGEND THERAPEUTICS CO LTD·Filed 2023·Granted Sep 10, 2024·4 cites·1 claims
- 0963US2025019267A1High Efficiency UV LED Reactor for Flow Treatment and Sterilization of FluidsTSLC CORP·Filed 2024·Application pending·0 cites
- 1062US2021111318A1Uv led packageTSLC CORP·Filed 2019·Application pending·0 cites
- 1161US2025000229A1Nail Product Curing System And Method For Curing Nail ProductsTSLC CORP·Filed 2023·Application pending·0 cites
- 1258US8875083B2Routing method for flip chip package and apparatus using the sameSYNOPSYS INC·Filed 2013·Granted Oct 28, 2014·1 cites·9 claims
- 1355US2022064687A1Hydrogel composition, manufacturing method thereof and enzymatically formed hydrogel compositionBIOGEND THERAPEUTICS CO LTD·Filed 2021·Application pending·0 cites
- 1451US2023091760A1Three-dimensional optoelectronic device package and method for manufacturing the sameTSLC CORP·Filed 2022·Application pending·0 cites
- 1550US11545487B2Three-dimensional optoelectronic device package and method for manufacturing the sameTSLC CORP·Filed 2020·Granted Jan 3, 2023·0 cites·19 claims
- 1647US2025248372A1Uv led device for treating fluidsTSLC CORP·Filed 2025·Application pending·0 cites
- 1745US2021252227A1Cartilage filling system and surgical instrument kit including the sameBIOGEND THERAPEUTICS CO LTD·Filed 2020·Application pending·0 cites
- 1840US8578317B2Routing method for flip chip package and apparatus using the sameCHANG CHEN-FENG·Filed 2010·Granted Nov 5, 2013·0 cites·17 claims
- 1929US8477579B2Writing method for optical disk driveLEE PO-WEI·Filed 2011·Granted Jul 2, 2013·0 cites·9 claims
Join the waitlist — get patent alerts
Get an alert when Po-Wei Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →