Inventor · disambiguated record
Pong S. Sheih
Also filed as: SHEIH PONG S · SHEIH PONG SU
10 granted patents·122 citations·filing 1980–1993
89Inventor score
Files withDOW CHEMICAL CO10
Top patents by PatentIndex Score
10 records- 0182US5095050AAdvanced epoxy compositions, curable compositions and cured productsDOW CHEMICAL CO·Filed 1990·Granted Mar 10, 1992·31 cites·17 claims
- 0277US5057557AModified epoxy resin compositionsDOW CHEMICAL CO·Filed 1990·Granted Oct 15, 1991·25 cites·22 claims
- 0367US5310854AEpoxy resin composition and process thereforDOW CHEMICAL CO·Filed 1989·Granted May 10, 1994·18 cites·37 claims
- 0459US5151485AAdvanced epoxy compositions, curable compositions and cured productsDOW CHEMICAL CO·Filed 1991·Granted Sep 29, 1992·11 cites·2 claims
- 0555US5147905AAdvanced and unadvanced compositions, nucleophilic derivatives thereof and curable and coating compositions thereofDOW CHEMICAL CO·Filed 1991·Granted Sep 15, 1992·14 cites·5 claims
- 0651US4596861AAdvanced epoxy resin for can coating applicationsDOW CHEMICAL CO·Filed 1985·Granted Jun 24, 1986·13 cites·6 claims
- 0736US4273921AWater-soluble epoxy resins and process for their preparationDOW CHEMICAL CO·Filed 1980·Granted Jun 16, 1981·5 cites·5 claims
- 0833US5386008AAdvanced and unadvanced compositions, nucleophilic derivatives thereof and curable and coating compositions thereofDOW CHEMICAL CO·Filed 1993·Granted Jan 31, 1995·3 cites·8 claims
- 0930US5391652AHigh molecular weight epoxy ester resin composition, process therefor and coating compositionDOW CHEMICAL CO·Filed 1993·Granted Feb 21, 1995·2 cites·20 claims
- 1029US5244998AAdvanced and unadvanced compositions, nucleophilic derivatives thereof and curable coating compositions thereofDOW CHEMICAL CO·Filed 1992·Granted Sep 14, 1993·0 cites·6 claims
Join the waitlist — get patent alerts
Get an alert when Pong S. Sheih files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →