Inventor · disambiguated record

Po-Cheng Shih

Also filed as: SHIH PO-CHENG

45 granted patents·15 pending applications·143 citations·filing 2004–2025

97Inventor score

Files withTAIWAN SEMICONDUCTOR MFG CO LTD48 TAIWAN SEMICONDUCTOR MFG5 SHIH PO-CHENG4 AU OPTRONICS CORP1 CHENG YIN-TSUNG1

Top patents by PatentIndex Score

60 records

0198US10163691B2Low-K dielectric interconnect systemsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·36 cites·20 claims
0297US11374127B2Multi-layer film device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 28, 2022·4 cites·20 claims
0397US9754822B1Interconnect structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 5, 2017·30 cites·20 claims
0496US12033890B2Patterning interconnects and other structures by photo-sensitizing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 9, 2024·2 cites·20 claims
0595US11676855B2Patterning interconnects and other structures by photo-sensitizing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 13, 2023·3 cites·20 claims
0693US9842804B2Methods for reducing dual damascene distortionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 12, 2017·7 cites·20 claims
0791US8470708B2Double patterning strategy for contact hole and trench in photolithographySHIH PO-CHENG·Filed 2010·Granted Jun 25, 2013·16 cites·20 claims
0891US2025357108A1Low-k dielectric and processes for forming same forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0990US10727350B2Multi-layer film device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 28, 2020·4 cites·20 claims
1089US10707165B2Semiconductor device having an extra low-k dielectric layer and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 7, 2020·4 cites·20 claims
1188US10269627B2Interconnect structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·4 cites·20 claims
1288US10199500B2Multi-layer film device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 5, 2019·4 cites·20 claims
1388US9768061B1Low-k dielectric interconnect systemsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 19, 2017·4 cites·20 claims
1487US10840134B2Interconnect structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 17, 2020·3 cites·20 claims
1587US2024395939A1Multi-layer film device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
1685US2025344422A1Dummy hybrid film for self alignment contact formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1784US11282742B2Semiconductor device with multi-layer etch stop structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 22, 2022·2 cites·20 claims
1883US12166128B2Multi-layer film device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
1983US2024371769A1Semiconductor device having an extra low-k dielectric layer and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2082US12198979B2Semiconductor device with multi-layer etch stop structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
2180US12387974B2Patterning interconnects and other structures by photo-sensitizing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
2279US12148696B2Methods for reducing dual damascene distortionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 19, 2024·0 cites·20 claims
2379US12062613B2Semiconductor device having an extra low-k dielectric layer and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 13, 2024·0 cites·20 claims
2479US11777035B2Multi-layer film device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 3, 2023·0 cites·20 claims
2579US2025343051A1Method for forming a semiconductor device having a gate mask composing of a semiconductor layer over a dielectric layer formed on gate electrodeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2679US2025349600A1Dielectric Layers Having Nitrogen-Containing Crusted SurfacesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2779US2024379815A1Dummy hybrid film for self alignment contact formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2878US9130017B2Methods for forming interconnect structures of integrated circuitsSHIH PO-CHENG·Filed 2011·Granted Sep 8, 2015·4 cites·19 claims
2977US2025331276A1Isolation layers for reducing leakages between contactsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3076US2025336714A1Isolation regions for isolating transistors and the methods forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3175US2025279317A1Semiconductor devices and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3275US2025323099A1Hybrid film scheme for self-aligned contactTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3374US11848231B2Method for forming semiconductor device with multi-layer etch stop structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·0 cites·20 claims
3473US12424438B2Low-k dielectric and processes for forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 23, 2025·0 cites·20 claims
3573US12322647B2Semiconductor devices and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 3, 2025·0 cites·20 claims
3673US12302595B2Dummy hybrid film for self-alignment contact formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 13, 2025·0 cites·20 claims
3773US11482493B2Methods for reducing dual damascene distortionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 25, 2022·0 cites·20 claims
3872US11417602B2Semiconductor device having an extra low-k dielectric layer and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·0 cites·20 claims
3971US11328952B2Interconnect structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 10, 2022·0 cites·20 claims
4070US8994178B2Interconnect structure and method for forming the sameSHIH PO-CHENG·Filed 2012·Granted Mar 31, 2015·2 cites·20 claims
4169US9257331B2Method of making interconnect structureTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 9, 2016·1 cites·20 claims
4268US8993435B2Low-k Cu barriers in damascene interconnect structuresWANG KUAN-CHEN·Filed 2010·Granted Mar 31, 2015·3 cites·18 claims
4367US11062901B2Low-k dielectric and processes for forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 13, 2021·0 cites·20 claims
4467US2024120236A1Isolation Regions For Isolating Transistors and the Methods Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
4566US9269614B2Method of forming semiconductor device using remote plasma treatmentTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Feb 23, 2016·1 cites·20 claims
4666US9236294B2Method for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 12, 2016·1 cites·20 claims
4766US2023317469A1Semiconductor Device and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
4864US8993442B2Interconnect structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 31, 2015·1 cites·20 claims
4964US2023154992A1Isolation Layers for Reducing Leakages Between ContactsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
5063US12417948B2Hybrid film scheme for self-aligned contactTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 16, 2025·0 cites·20 claims

Showing the top 50 of 60 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →