Inventor · disambiguated record
Pooya Tadayon
Also filed as: TADAYON POOYA
59 granted patents·31 pending applications·148 citations·filing 2001–2025
97Inventor score
Top patents by PatentIndex Score
90 records- 0194US12164147B2Device, method and system for optical communication with a waveguide structure and an integrated optical coupler of a photonic integrated circuit chipINTEL CORP·Filed 2021·Granted Dec 10, 2024·3 cites·18 claims
- 0292US11372023B2Slip-plane MEMs probe for high-density and fine pitch interconnectsINTEL CORP·Filed 2021·Granted Jun 28, 2022·2 cites·20 claims
- 0391US6574963B1Electrical energy-generating heat sink system and method of using same to recharge an energy storage deviceINTEL CORP·Filed 2001·Granted Jun 10, 2003·40 cites·53 claims
- 0490US11024601B2HyperchipINTEL CORP·Filed 2017·Granted Jun 1, 2021·4 cites·22 claims
- 0588US12057370B2Vacuum modulated two phase cooling loop efficiency and parallelism enhancementINTEL CORP·Filed 2020·Granted Aug 6, 2024·2 cites·13 claims
- 0687US12355002B2HyperchipINTEL CORP·Filed 2024·Granted Jul 8, 2025·0 cites·20 claims
- 0787US11824041B2HyperchipINTEL CORP·Filed 2021·Granted Nov 21, 2023·1 cites·14 claims
- 0887US10935573B2Slip-plane MEMS probe for high-density and fine pitch interconnectsINTEL CORP·Filed 2018·Granted Mar 2, 2021·4 cites·18 claims
- 0986US11756860B2Semiconductor device stack-up with bulk substrate material to mitigate hot spotsINTEL CORP·Filed 2019·Granted Sep 12, 2023·3 cites·25 claims
- 1086US11622466B2Low force liquid metal interconnect solutionsINTEL CORP·Filed 2020·Granted Apr 4, 2023·2 cites·21 claims
- 1186US6877318B2Electrical energy-generating heat sink system and method of using same to recharge an energy storage deviceINTEL CORP·Filed 2003·Granted Apr 12, 2005·28 cites·35 claims
- 1285US12074138B2HyperchipINTEL CORP·Filed 2023·Granted Aug 27, 2024·0 cites·20 claims
- 1384US12341080B2Semiconductor device stack-up with bulk substrate material to mitigate hot spotsINTEL CORP·Filed 2024·Granted Jun 24, 2025·0 cites·20 claims
- 1484US2025293117A1Semiconductor device stack-up with bulk substrate material to mitigate hot spotsINTEL CORP·Filed 2025·Application pending·0 cites
- 1582US11984430B2HyperchipINTEL CORP·Filed 2023·Granted May 14, 2024·0 cites·8 claims
- 1682US11515232B2Liquid cooling through conductive interconnectINTEL CORP·Filed 2019·Granted Nov 29, 2022·3 cites·25 claims
- 1782US11189585B2Selective recess of interconnects for probing hybrid bond devicesINTEL CORP·Filed 2019·Granted Nov 30, 2021·3 cites·17 claims
- 1882US10877068B2High density and fine pitch interconnect structures in an electric test apparatusINTEL CORP·Filed 2019·Granted Dec 29, 2020·2 cites·20 claims
- 1980US9360502B2Increasing current carrying capability through direct liquid cooling of test contactsCRIPPEN WARREN S·Filed 2011·Granted Jun 7, 2016·7 cites·23 claims
- 2079US11978689B2Semiconductor device stack-up with bulk substrate material to mitigate hot spotsINTEL CORP·Filed 2022·Granted May 7, 2024·0 cites·20 claims
- 2177US10677845B2Converged test platforms and processes for class and system testing of integrated circuitsINTEL CORP·Filed 2017·Granted Jun 9, 2020·2 cites·28 claims
- 2277US9523713B2Interconnects including liquid metalINTEL CORP·Filed 2013·Granted Dec 20, 2016·5 cites·16 claims
- 2375US12230610B2Double-sided substrate with cavities for direct die-to-die interconnectINTEL CORP·Filed 2023·Granted Feb 18, 2025·0 cites·21 claims
- 2474US12032002B2Chevron interconnect for very fine pitch probingINTEL CORP·Filed 2022·Granted Jul 9, 2024·0 cites·20 claims
- 2573US12349303B2Low force liquid metal interconnect solutionsINTEL CORP·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
- 2673US6627978B2Chip package enabling increased input/output densityINTEL CORP·Filed 2001·Granted Sep 30, 2003·20 cites·19 claims
- 2772US11774489B2Multi-member test probe structureINTEL CORP·Filed 2021·Granted Oct 3, 2023·0 cites·20 claims
- 2871US12500137B2Directly impinging pressure modulated spray cooling and methods of target temperature controlINTEL CORP·Filed 2023·Granted Dec 16, 2025·0 cites·5 claims
- 2971US11249113B2High density and fine pitch interconnect structures in an electric test apparatusINTEL CORP·Filed 2020·Granted Feb 15, 2022·0 cites·20 claims
- 3070US7411337B2Electrical energy-generating system and devices and methods related theretoINTEL CORP·Filed 2004·Granted Aug 12, 2008·16 cites·51 claims
- 3168US11822249B2Method and apparatus to develop lithographically defined high aspect ratio interconnectsINTEL CORP·Filed 2021·Granted Nov 21, 2023·0 cites·14 claims
- 3268US11626395B2Thermal spreading management of 3D stacked integrated circuitsINTEL CORP·Filed 2021·Granted Apr 11, 2023·0 cites·20 claims
- 3365US12411296B2Reworkable zero-force insertion electrical optical package socket and methodINTEL CORP·Filed 2021·Granted Sep 9, 2025·0 cites·23 claims
- 3464US12272484B2Coreless electronic substrates having embedded inductorsINTEL CORP·Filed 2021·Granted Apr 8, 2025·0 cites·21 claims
- 3563US12413001B2Heterogenous socket contact for electrical and mechanical performance scaling in a microelectronic packageINTEL CORP·Filed 2021·Granted Sep 9, 2025·0 cites·25 claims
- 3662US12345932B2Die last and waveguide last architecture for silicon photonic packagingINTEL CORP·Filed 2021·Granted Jul 1, 2025·0 cites·19 claims
- 3762US11061068B2Multi-member test probe structureINTEL CORP·Filed 2017·Granted Jul 13, 2021·0 cites·20 claims
- 3862US7960190B2Temporary package for at-speed functional test of semiconductor chipINTEL CORP·Filed 2008·Granted Jun 14, 2011·1 cites·13 claims
- 3961US12313890B2Through-substrate optical viasINTEL CORP·Filed 2021·Granted May 27, 2025·0 cites·20 claims
- 4059US11817423B2Double-sided substrate with cavities for direct die-to-die interconnectINTEL CORP·Filed 2019·Granted Nov 14, 2023·0 cites·25 claims
- 4159US11268983B2Chevron interconnect for very fine pitch probingINTEL CORP·Filed 2017·Granted Mar 8, 2022·0 cites·13 claims
- 4259US2025216629A1Mechanical alignment features for glass waveguide to photonic integrated circuit matingINTEL CORP·Filed 2023·Application pending·0 cites
- 4358US10488438B2High density and fine pitch interconnect structures in an electric test apparatusINTEL CORP·Filed 2018·Granted Nov 26, 2019·0 cites·20 claims
- 4458US2025309571A1Liquid metal socket interconnects with lithographically defined socket contact pinsINTEL CORP·Filed 2024·Application pending·0 cites
- 4558US2025293137A13d die stack redistribution layer for topside power delivery to backside die metallization in multichip composite devicesINTEL CORP·Filed 2024·Application pending·0 cites
- 4657US12506083B2Liquid metal interconnect for modular package server architectureINTEL CORP·Filed 2021·Granted Dec 23, 2025·0 cites·20 claims
- 4757US12436314B2Technologies for chip-to-chip optical data transfer backgroundINTEL CORP·Filed 2021·Granted Oct 7, 2025·0 cites·25 claims
- 4857US11127727B2Thermal spreading management of 3D stacked integrated circuitsINTEL CORP·Filed 2019·Granted Sep 21, 2021·0 cites·18 claims
- 4956US2025219021A1Vertically embedded components in package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 5056US2025079278A1Liquid metal socket interconnects with liquid passivation layer and filler materialsINTEL CORP·Filed 2023·Application pending·0 cites
Showing the top 50 of 90 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →