Inventor · disambiguated record

Po-Yuan Teng

Also filed as: TENG PO-YUAN

35 granted patents·17 pending applications·42 citations·filing 2008–2025

96Inventor score

Technology areasH10W H04L C23C C01B H01L

Files withTAIWAN SEMICONDUCTOR MFG CO LTD43 IND TECH RES INST3 NAT UNIV TSING HUA2 TENG PO-YUAN2 TAIWAN SEMICONDUCTOR MAMUFACTURING CO LTD1

Top patents by PatentIndex Score

52 records

0198US11502013B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 15, 2022·4 cites·20 claims
0294US12009281B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 11, 2024·2 cites·20 claims
0392US12057405B2Packages with thick RDLs and thin RDLs stacked alternatinglyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 6, 2024·1 cites·20 claims
0492US11646255B2Chip package structure including a silicon substrate interposer and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 9, 2023·2 cites·20 claims
0590US12051666B2Package structure and manufacturing method of package structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 30, 2024·1 cites·20 claims
0690US11508665B2Packages with thick RDLs and thin RDLs stacked alternatinglyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 22, 2022·2 cites·20 claims
0789US11355466B2Package structure and manufacturing method of package structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 7, 2022·2 cites·20 claims
0889US10510686B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·4 cites·20 claims
0985US2025096198A1Semiconductor device, circuit board structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
1083US2025096203A1Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
1182US11282791B2Semiconductor device having a heat dissipation structure connected chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 22, 2022·2 cites·20 claims
1282US11004758B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·2 cites·20 claims
1381US11004827B2Semiconductor package and manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 11, 2021·2 cites·20 claims
1480US12205923B2Semiconductor device, circuit board structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 21, 2025·0 cites·20 claims
1580US11177192B2Semiconductor device including heat dissipation structure and fabricating method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 16, 2021·2 cites·20 claims
1680US8871302B2Chemical vapor deposition of graphene on dielectricsTENG PO-YUAN·Filed 2012·Granted Oct 28, 2014·3 cites·11 claims
1780US2025357298A13d stacking structure and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1879US11239135B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 1, 2022·2 cites·16 claims
1979US2024355754A1Packages with thick rdls and thin rdls stacked alternatinglyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2078US12166015B2Semiconductor package and manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
2178US11990381B2Integrated circuit packages having support ringsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 21, 2024·0 cites·20 claims
2278US11289373B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 29, 2022·2 cites·20 claims
2378US2025239528A1Semiconductor device having a heat dissipation structure connected chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2478US2024339427A1Manufacturing method of package structure and package structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2578US2024290703A1Chip package structure including a silicon substrate interposer and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2677US12014976B2Chip package structure including a silicon substrate interposer and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 18, 2024·0 cites·20 claims
2777US11569202B2Semiconductor device, circuit board structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
2877US10797008B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 6, 2020·1 cites·20 claims
2976US10734328B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 4, 2020·1 cites·20 claims
3075US12300618B2Semiconductor device having a heat dissipation structure connected chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 13, 2025·0 cites·20 claims
3175US2025323211A1Integrated Circuit Package and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3274US8090106B2Multi-level data encryption and decryption system and method thereofTENG PO-YUAN·Filed 2008·Granted Jan 3, 2012·7 cites·42 claims
3374US2025323107A1Method of forming semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3473US12406961B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 2, 2025·0 cites·20 claims
3572US11508671B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 22, 2022·0 cites·20 claims
3672US10985115B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 20, 2021·0 cites·20 claims
3771US11646296B2Semiconductor package and manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 9, 2023·0 cites·20 claims
3870US11694943B2Semiconductor device including heat dissipation structure and fabricating method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 4, 2023·0 cites·20 claims
3969US11848233B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·0 cites·20 claims
4069US2024282686A13D Stacking Structure and Method of Fabricating the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
4164US10060029B2Graphene manufacturing methodUNIV NAT TSING HUA·Filed 2015·Granted Aug 28, 2018·0 cites·12 claims
4264US2014044874A1Graphene manufacturing system and the method thereofNAT UNIV TSING HUA·Filed 2013·Application pending·0 cites
4362US12489064B2Method for forming mark, packaging method of semiconductor device, and semiconductor device having the markTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 2, 2025·0 cites·20 claims
4462US11088110B2Semiconductor device, circuit board structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·0 cites·20 claims
4562US2025329672A1Bonding scheme to provide improved coplanarity and high joint yields with reduced costs and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4661US12374592B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 29, 2025·0 cites·14 claims
4756US2024304531A1Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
4853US2024019486A1Alignment Mark Design for Wafer-Level Testing and Method Forming the SameTAIWAN SEMICONDUCTOR MAMUFACTURING CO LTD·Filed 2023·Application pending·0 cites
4946US2009276625A1Hierarchical browsing management method and system for digital contentIND TECH RES INST·Filed 2008·Application pending·0 cites
5044US2010146280A1Remote assisting method and systemIND TECH RES INST·Filed 2009·Application pending·0 cites

Showing the top 50 of 52 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →