Inventor · disambiguated record
Poi Siong Teo
Also filed as: TEO POI S · TEO POI SIONG
1 granted patent·3 pending applications·28 citations·filing 2003–2024
43Inventor score
Top patents by PatentIndex Score
4 records- 0173US6890795B1Wafer level super stretch solderGEORGIA TECH RES INST·Filed 2003·Granted May 10, 2005·28 cites·31 claims
- 0257US2025140734A1Molded power die package with vertical interconnectINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 0337US2010170086A1Device, unit, system and method for the magnetically-assisted assembling of chip-scale, and nano and micro-scale components onto a substrateAGENCY SCIENCE TECH & RES·Filed 2006·Application pending·0 cites
- 0430US2006057763A1Method of forming a surface mountable IC and its assemblyAGENCY SCIENCE TECH & RES·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →