Inventor · disambiguated record
Po-Han Wang
Also filed as: WANG PO-HAN · WANG PO-HAN PETER
52 granted patents·34 pending applications·67 citations·filing 2009–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD76UNIV CALIFORNIA5MEDIATEK INC2UNIV NAT TAIWAN2YANG CHIA-LIN1
Top patents by PatentIndex Score
86 records- 0195US11942435B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 26, 2024·2 cites·20 claims
- 0294US11892774B2LithographyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·2 cites·20 claims
- 0394US10872864B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 22, 2020·10 cites·20 claims
- 0493US11973023B2Stacked via structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 30, 2024·2 cites·20 claims
- 0593US10510645B2Planarizing RDLs in RDL-first processes through CMP processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·7 cites·20 claims
- 0691US11948918B2Redistribution structure for semiconductor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 2, 2024·2 cites·20 claims
- 0791US11664323B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 30, 2023·2 cites·20 claims
- 0891US2025364321A1Integrated Circuit Package and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0990US11532540B2Planarizing RDLS in RDL-first processes through CMP processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·2 cites·20 claims
- 1090US10283461B1Info structure and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 7, 2019·4 cites·20 claims
- 1188US10529675B2Info structure and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 7, 2020·3 cites·20 claims
- 1288US2025364342A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1387US11121006B2Semiconductor package comprising molding compound having extended portion and manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 14, 2021·2 cites·20 claims
- 1487US11101176B2Method of fabricating redistribution circuit structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 24, 2021·3 cites·20 claims
- 1586US11570709B2BLE and/or WiFi compliant and blocker-resilient wake-up receiver and methodUNIV CALIFORNIA·Filed 2020·Granted Jan 31, 2023·2 cites·16 claims
- 1685US10804946B2Low power wake-up receiverUNIV CALIFORNIA·Filed 2018·Granted Oct 13, 2020·6 cites·18 claims
- 1785US10332856B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 25, 2019·3 cites·20 claims
- 1885US2025069951A1Method of Fabricating Redistribution Circuit StructureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1984US11309265B2Methods of fabricating semiconductor devices having conductive pad structures with multi-barrier filmsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 19, 2022·3 cites·20 claims
- 2084US2025300115A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2183US12476139B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 2283US12170223B2Method of fabricating redistribution circuit structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 17, 2024·0 cites·20 claims
- 2383US2025316647A1Redistribution structure for semiconductor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2482US12381186B2Redistribution structure for semiconductor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 5, 2025·0 cites·20 claims
- 2582US10522440B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 31, 2019·2 cites·20 claims
- 2682US2024379606A1Method for manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2782US2024234299A1Stacked via structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2881US11942417B2Sensor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 26, 2024·1 cites·20 claims
- 2981US11682647B2Semiconductor package and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 20, 2023·1 cites·20 claims
- 3081US11532531B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 20, 2022·2 cites·20 claims
- 3180US12347801B2Semiconductor package and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
- 3279US12298667B2LithographyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 3378US12416862B2Apparatus, system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 16, 2025·0 cites·20 claims
- 3478US10529593B2Semiconductor package comprising molding compound having extended portion and manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 7, 2020·2 cites·15 claims
- 3578US2025380217A1Low power wi-fi backscatter communicationUNIV CALIFORNIA·Filed 2025·Application pending·0 cites
- 3677US12051659B2Semiconductor devices having conductive pad structures with multi-barrier filmsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 30, 2024·0 cites·20 claims
- 3777US11164839B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 2, 2021·2 cites·20 claims
- 3877US2025336741A1Semiconductor packages and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3977US2025343189A1Multiple polymer layers as the encapsulant of conductive viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4076US12094765B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 17, 2024·0 cites·20 claims
- 4176US2024385525A1Apparatus, system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4276US2025323215A1Semiconductor package structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4375US12469759B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·20 claims
- 4475US2025343151A1Integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4574US11817352B2Method of fabricating redistribution circuit structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 14, 2023·0 cites·20 claims
- 4674US10763206B2Method of fabricating integrated fan-out packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 1, 2020·1 cites·20 claims
- 4774US2025323107A1Method of forming semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4873US11688703B2Methods of fabricating semiconductor devices having conductive pad structures with multi-barrier filmsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 27, 2023·0 cites·20 claims
- 4973US11682636B2Info structure and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 20, 2023·0 cites·20 claims
- 5073US11342296B2Semiconductor structure, semiconductor package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·0 cites·20 claims
Showing the top 50 of 86 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →