Inventor · disambiguated record
Po-Yi Wu
Also filed as: WU PO-YI
27 granted patents·10 pending applications·166 citations·filing 2010–2025
93Inventor score
Files withFOCI FIBER OPTIC COMMUNICATIONS INC10SILICONWARE PRECISION INDUSTRIES CO LTD10POWERCHIP SEMICONDUCTOR MFG CORP4HSIEH HSIEH-HUNG3TPK UNIVERSAL SOLUTIONS LTD2
Top patents by PatentIndex Score
37 records- 0197US8427240B2Low-noise amplifier with gain enhancementHSIEH HSIEH-HUNG·Filed 2010·Granted Apr 23, 2013·79 cites·19 claims
- 0297US8279008B2CMOS millimeter-wave variable-gain low-noise amplifierHSIEH HSIEH-HUNG·Filed 2010·Granted Oct 2, 2012·72 cites·19 claims
- 0390US11921334B2Alignment structure of optical elementFOCI FIBER OPTIC COMMUNICATIONS INC·Filed 2022·Granted Mar 5, 2024·2 cites·6 claims
- 0481US9903024B2Substrate having electrical interconnection structures and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Feb 27, 2018·3 cites·17 claims
- 0579US8295018B2Transmission-line-based ESD protectionHSIEH HSIEH-HUNG·Filed 2010·Granted Oct 23, 2012·5 cites·21 claims
- 0675US12306448B2Alignment structure of optical elementFOCI FIBER OPTIC COMMUNICATIONS INC·Filed 2024·Granted May 20, 2025·0 cites·7 claims
- 0775US2025093595A1Assembly alignment structure for optical componentFOCI FIBER OPTIC COMMUNICATIONS INC·Filed 2024·Application pending·0 cites
- 0873US9746976B2Touch control device and fabrication method thereofTPK UNIVERSAL SOLUTIONS LTD·Filed 2015·Granted Aug 29, 2017·4 cites·10 claims
- 0969US12197022B2Assembly alignment structure for optical componentFOCI FIBER OPTIC COMMUNICATIONS INC·Filed 2022·Granted Jan 14, 2025·0 cites·8 claims
- 1068US12449609B2Semiconductor structureFOCI FIBER OPTIC COMMUNICATIONS INC·Filed 2023·Granted Oct 21, 2025·0 cites·7 claims
- 1168US11913121B2Fabrication method of substrate having electrical interconnection structuresSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Feb 27, 2024·0 cites·3 claims
- 1266US11367728B2Memory structurePOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2020·Granted Jun 21, 2022·0 cites·7 claims
- 1365US11367727B2Memory structurePOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2020·Granted Jun 21, 2022·0 cites·6 claims
- 1459US11803015B2Optical probe for optoelectronic integrated circuitsFOCI FIBER OPTIC COMMUNICATIONS INC·Filed 2022·Granted Oct 31, 2023·0 cites·8 claims
- 1558US10868017B2Memory structure and manufacturing method thereofPOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2019·Granted Dec 15, 2020·0 cites·5 claims
- 1658US10811367B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Oct 20, 2020·0 cites·9 claims
- 1757US12468098B2Optical interposer for chip connectionFOCI FIBER OPTIC COMMUNICATIONS INC·Filed 2023·Granted Nov 11, 2025·0 cites·3 claims
- 1856US10774427B2Fabrication method of substrate having electrical interconnection structuresSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Sep 15, 2020·0 cites·5 claims
- 1955US10340228B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Jul 2, 2019·0 cites·9 claims
- 2053US11947172B2Optical probe package structureFOCI FIBER OPTIC COMMUNICATIONS INC·Filed 2022·Granted Apr 2, 2024·0 cites·9 claims
- 2153US8451033B2Millimeter-wave wideband frequency doublerWU PO-YI·Filed 2010·Granted May 28, 2013·1 cites·18 claims
- 2251US9786610B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Oct 10, 2017·0 cites·12 claims
- 2350US12411295B2Pluggable optical packing structureFOCI FIBER OPTIC COMMUNICATIONS INC·Filed 2023·Granted Sep 9, 2025·0 cites·6 claims
- 2450US2018225610A1Production planning method with empirical capacity constraintsUNIV NAT TSING HUA·Filed 2017·Application pending·0 cites
- 2549US2024345329A1Light-coupling deviceFOCI FIBER OPTIC COMMUNICATIONS INC·Filed 2023·Application pending·0 cites
- 2648US2025266383A1Conductive bump structure and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2025·Application pending·0 cites
- 2746US10192838B2Fabrication method of packaging substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Jan 29, 2019·0 cites·9 claims
- 2846US2024249494A1Enviroment managing and monitoring system and method using sameNAVCORE TECH CO LTD·Filed 2023·Application pending·0 cites
- 2944US11321590B2Training method and system of objects detection model based on adaptive annotation designIND TECH RES INST·Filed 2020·Granted May 3, 2022·0 cites·20 claims
- 3043US11514715B2Deepfake video detection system and methodUNIV NAT CHENG KUNG·Filed 2021·Granted Nov 29, 2022·0 cites·9 claims
- 3143US2025125802A1Control device for power switch, control method for power switch and electronic display systemWU PO YI·Filed 2024·Application pending·0 cites
- 3242US2019273054A1Substrate structure and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Application pending·0 cites
- 3340US10338760B2Touch sensor unit and touch sensor deviceTPK UNIVERSAL SOLUTIONS LTD·Filed 2015·Granted Jul 2, 2019·0 cites·26 claims
- 3440US2014187233A1Watch type mobile terminalCOMPAL COMMUNICATIONS INC·Filed 2012·Application pending·0 cites
- 3539US2013113095A1Packaging substrate and fabrication method thereofCHUANG CHIEN-LUNG·Filed 2012·Application pending·0 cites
- 3638US11152370B2Memory structure having transistors and capacitor and manufacturing method thereofPOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2019·Granted Oct 19, 2021·0 cites·18 claims
- 3729US2016050753A1Interposer and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →