Inventor · disambiguated record
Po Chih Yang
Also filed as: YANG PO-CHIH
7 granted patents·3 pending applications·21 citations·filing 2004–2024
76Inventor score
Top patents by PatentIndex Score
10 records- 0176US11171109B2Techniques for forming semiconductor device packages and related packages, intermediate products, and methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Nov 9, 2021·2 cites·15 claims
- 0274US2025046743A1Semiconductor device assemblies and systems with one or more dies at least partially embedded in a redistribution layer (rdl) and methods for making the sameMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0370US12046513B2Die corner protection by using polymer deposition technologyMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 23, 2024·0 cites·11 claims
- 0467USD504892SMonitorCHI LIN TECHNOLOGY CO LTD·Filed 2004·Granted May 10, 2005·19 cites·1 claims
- 0561US12125816B2Semiconductor device assemblies and systems with one or more dies at least partially embedded in a redistribution layer (RDL) and methods for making the sameMICRON TECHNOLOGY INC·Filed 2021·Granted Oct 22, 2024·0 cites·10 claims
- 0661US12062635B2Semiconductor device packages including conductors electrically connecting stacked semiconductor devices by extending along surfaces of the semiconductor devicesMICRON TECHNOLOGY INC·Filed 2021·Granted Aug 13, 2024·0 cites·17 claims
- 0759US11393720B2Die corner protection by using polymer deposition technologyMICRON TECHNOLOGY INC·Filed 2020·Granted Jul 19, 2022·0 cites·16 claims
- 0851US11705421B2Apparatus including solder-core connectors and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2021·Granted Jul 18, 2023·0 cites·20 claims
- 0947US2023290684A1Structures and methods for dicing semiconductor devicesMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 1040US2005207101A1Display device having an adjustable display screenCHI LIN TECHNOLOGY CO LTD·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →