Inventor · disambiguated record
Poh Hoong Yong
Also filed as: YONG POH HOONG
0 granted patents·2 pending applications·0 citations·filing 2023–2024
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0141US2025246568A1Metallization structure having an outer metallization layer comprising nickel and platinum layers to reduce inter-metal compound formationRF360 SINGAPORE PTE LTD·Filed 2024·Application pending·0 cites
- 0240US2025096164A1Die package with guard structure to reduce or prevent material seepage into air cavity, and related fabrication methodsQUALCOMM TECHNOLOGIES INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →