Inventor · disambiguated record
Pranav K. Desai
Also filed as: DESAI PRANAV K
2 granted patents·4 citations·filing 2011–2016
50Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0174US9943931B2High performance transient uniform cooling solution for thermal compression bonding processINTEL CORP·Filed 2016·Granted Apr 17, 2018·2 cites·8 claims
- 0266US9434029B2High performance transient uniform cooling solution for thermal compression bonding processLI ZHIHUA·Filed 2011·Granted Sep 6, 2016·2 cites·36 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →