Inventor · disambiguated record
Pratyush Mishra
Also filed as: MISHRA PRATYUSH
0 granted patents·16 pending applications·0 citations·filing 2023–2024
Technology areasH10W
Top patents by PatentIndex Score
16 records- 0157US2025218963A1Die and conductive vias embedded in a substrateINTEL CORP·Filed 2023·Application pending·0 cites
- 0257US2025218915A1Pedestal structure for passive circuit component structureINTEL CORP·Filed 2023·Application pending·0 cites
- 0357US2025293172A1Semiconductor package with bridge die over embedded interposerINTEL CORP·Filed 2024·Application pending·0 cites
- 0457US2025285926A1Core joining for embedded die within package substratesINTEL CORP·Filed 2024·Application pending·0 cites
- 0556US2025218952A1Spacer for embedded component in coreINTEL CORP·Filed 2023·Application pending·0 cites
- 0656US2025218983A1Microelectronic structures including embedded integrated capacitor in multilayer coreINTEL CORP·Filed 2023·Application pending·0 cites
- 0756US2025218961A1Methods and apparatus to facilitate semiconductor device alignment in an integrated circuit packageINTEL CORP·Filed 2023·Application pending·0 cites
- 0855US2025192069A1Microelectronic assemblies with pre-singulation edge features in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 0955US2025201787A1Apparatus and methods for embedding deep trench capacitor (dtc) components in a substrateINTEL CORP·Filed 2023·Application pending·0 cites
- 1054US2025219040A1Technologies for Components Embedded in a Substrate CoreINTEL CORP·Filed 2023·Application pending·0 cites
- 1153US2025014954A1Hybrid cores including adhesive promotion layers and related methodsAGARWAL SOHAM·Filed 2024·Application pending·0 cites
- 1252US2024332100A1Glass-integrated inductors in integrated circuit packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 1352US2025112163A1Through-glass via liners for integrated circuit device packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 1451US2025220819A1Component embedded in mold material for mitigating thickness mismatch with coreINTEL CORP·Filed 2023·Application pending·0 cites
- 1551US2025112175A1Microelectronic assemblies with edge stress reduction in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 1650US2025105132A1Porous copper liner for through glass via (tgv) glass coresINTEL CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →