Inventor · disambiguated record
Prosanto K. Mukerji
Also filed as: MUKERJI PROSANTO · MUKERJI PROSANTO K
12 granted patents·652 citations·filing 1991–2004
93Inventor score
Top patents by PatentIndex Score
12 records- 0196US6300679B1Flexible substrate for packaging a semiconductor componentSEMICONDUCTOR COMPONENTS IND·Filed 1998·Granted Oct 9, 2001·239 cites·30 claims
- 0291US5863970AEpoxy resin composition with cycloaliphatic epoxy-functional siloxanePOLYSET COMP INC·Filed 1997·Granted Jan 26, 1999·149 cites·9 claims
- 0388US6787435B2GaN LED with solderable backside metalGELCORE LLC·Filed 2002·Granted Sep 7, 2004·57 cites·19 claims
- 0479US5614131AMethod of making an optoelectronic deviceMOTOROLA INC·Filed 1995·Granted Mar 25, 1997·71 cites·14 claims
- 0578US5442240AMethod of adhesion to a polyimide surface by formation of covalent bondsMOTOROLA INC·Filed 1994·Granted Aug 15, 1995·49 cites·4 claims
- 0673US7190005B2GaN LED with solderable backside metalGELCORE LLC·Filed 2004·Granted Mar 13, 2007·19 cites·14 claims
- 0750US6093583ASemiconductor component and method of manufactureSEMICONDUCTOR COMPONENTS IND·Filed 1998·Granted Jul 25, 2000·17 cites·19 claims
- 0850US5391397AMethod of adhesion to a polyimide surface by formation of covalent bondsMOTOROLA INC·Filed 1994·Granted Feb 21, 1995·15 cites·16 claims
- 0947US5183692APolyimide coating having electroless metal plateMOTOROLA INC·Filed 1991·Granted Feb 2, 1993·15 cites·4 claims
- 1038US6147410AElectronic component and method of manufactureMOTOROLA INC·Filed 1998·Granted Nov 14, 2000·10 cites·18 claims
- 1137US5930652ASemiconductor encapsulation methodMOTOROLA INC·Filed 1996·Granted Jul 27, 1999·9 cites·20 claims
- 1226US6372526B1Method of manufacturing semiconductor componentsSEMICONDUCTOR COMPONENTS IND·Filed 1998·Granted Apr 16, 2002·2 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →