Inventor · disambiguated record
Pradeep Rai
Also filed as: RAI PRADEEP · RAI PRADEEP KUMAR
6 granted patents·5 pending applications·11 citations·filing 2011–2024
72Inventor score
Top patents by PatentIndex Score
11 records- 0189US11830849B2Semiconductor device with unbalanced die stackupWESTERN DIGITAL TECH INC·Filed 2021·Granted Nov 28, 2023·2 cites·20 claims
- 0283US9773766B2Semiconductor device including independent film layer for embedding and/or spacing semiconductor dieSANDISK SEMICONDUCTOR (SHANGHAI) CO LTD·Filed 2013·Granted Sep 26, 2017·8 cites·20 claims
- 0358US2025309196A1Embedded aligned fiducial markers for stacked fanout semiconductor deviceWESTERN DIGITAL TECH INC·Filed 2024·Application pending·0 cites
- 0456US2025239497A1Cavity tape for package protectionWESTERN DIGITAL TECH INC·Filed 2024·Application pending·0 cites
- 0553US11552040B2Package process, DAF replacementWESTERN DIGITAL TECH INC·Filed 2020·Granted Jan 10, 2023·0 cites·11 claims
- 0652US9038264B2Non-uniform vacuum profile die attach tipRAI PRADEEP KUMAR·Filed 2011·Granted May 26, 2015·1 cites·5 claims
- 0748US2022406695A1Semiconductor device package having a ball grid array with multiple solder ball materialsWESTERN DIGITAL TECH INC·Filed 2021·Application pending·0 cites
- 0848US2015155247A1Bridge structure for embedding semiconductor dieSANDISK SEMICONDUCTOR SHANGHAI CO LTD·Filed 2014·Application pending·0 cites
- 0947US2017179101A1Bridge structure for embedding semiconductor dieSANDISK SEMICONDUCTOR (SHANGHAI) CO LTD·Filed 2017·Application pending·0 cites
- 1046US9462694B2Spacer layer for embedding semiconductor dieSANDISK SEMICONDUCTOR (SHANGHAI) CO LTD·Filed 2014·Granted Oct 4, 2016·0 cites·22 claims
- 1139US10916878B2Unitary molded USB deviceWESTERN DIGITAL TECH INC·Filed 2018·Granted Feb 9, 2021·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →