Inventor · disambiguated record

Prasad Ramanathan

Also filed as: RAMANATHAN PRASAD

3 granted patents·1 citations·filing 2018–2019

47Inventor score

Technology areasH10W

Files withINTEL CORP3

Top patents by PatentIndex Score

3 records

0166US11456281B2Architecture and processes to enable high capacity memory packages through memory die stackingINTEL CORP·Filed 2018·Granted Sep 27, 2022·1 cites·16 claims
0250US11705417B2Backside metallization (BSM) on stacked die packages and external silicon at wafer level, singulated die level, or stacked dies levelINTEL CORP·Filed 2019·Granted Jul 18, 2023·0 cites·17 claims
0347US11587843B2Thermal bump networks for integrated circuit device assembliesINTEL CORP·Filed 2018·Granted Feb 21, 2023·0 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →