Inventor · disambiguated record
Prabudhya Roy Chowdhury
Also filed as: ROY CHOWDHURY PRABUDHYA
3 granted patents·13 pending applications·1 citations·filing 2022–2024
47Inventor score
Files withIBM16
Top patents by PatentIndex Score
16 records- 0184US12243913B2Self-aligned backside contact integration for transistorsIBM·Filed 2022·Granted Mar 4, 2025·1 cites·17 claims
- 0260US12438085B2Via to backside power rail through active regionIBM·Filed 2022·Granted Oct 7, 2025·0 cites·25 claims
- 0358US2025301791A1Semiconductor device with dielectric thermal conductorIBM·Filed 2024·Application pending·0 cites
- 0456US12490480B2Stacked FETS with contact placeholder structuresIBM·Filed 2022·Granted Dec 2, 2025·0 cites·19 claims
- 0556US2025273618A1Thermal compression bonding with contact area adjustmentIBM·Filed 2024·Application pending·0 cites
- 0656US2025379189A1Enhanced thermal solution for stacked cache die configurationIBM·Filed 2024·Application pending·0 cites
- 0755US2025294887A1Self-aligned isolation layer for stacked field-effect transistorsIBM·Filed 2024·Application pending·0 cites
- 0855US2025331301A1Inter-gate contacts for stacked field-effect transistorsIBM·Filed 2024·Application pending·0 cites
- 0954US2025357237A1Electronic structure including die with backside power deliveryIBM·Filed 2024·Application pending·0 cites
- 1052US2024290730A1Die bending stiffness modification through groovingIBM·Filed 2023·Application pending·0 cites
- 1152US2024088233A1Backside contact with full wrap-around contactIBM·Filed 2022·Application pending·0 cites
- 1251US2024105554A1Transistors with via-to-backside power rail spacersIBM·Filed 2022·Application pending·0 cites
- 1351US2024096752A1Via resistance to backside power railIBM·Filed 2022·Application pending·0 cites
- 1451US2024162319A1Spacer cut for asymmetric source/drain epitaxial structure in stacked fetIBM·Filed 2022·Application pending·0 cites
- 1551US2024072146A1Stacked device via to power element structureIBM·Filed 2022·Application pending·0 cites
- 1650US2023369218A1Interlevel via for stacked field-effect transistor deviceIBM·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →