Inventor · disambiguated record
Priyal Shah
Also filed as: SHAH PRIYAL
11 granted patents·2 pending applications·54 citations·filing 2018–2023
86Inventor score
Top patents by PatentIndex Score
13 records- 0197US10937755B2Bond pads for low temperature hybrid bondingADVANCED MICRO DEVICES INC·Filed 2018·Granted Mar 2, 2021·34 cites·16 claims
- 0296US11911839B2Low temperature hybrid bondingADVANCED MICRO DEVICES INC·Filed 2021·Granted Feb 27, 2024·5 cites·20 claims
- 0390US10593620B2Fan-out package with multi-layer redistribution layer structureAGARWAL RAHUL·Filed 2018·Granted Mar 17, 2020·7 cites·14 claims
- 0489US12249519B2Molded chip package with anchor structuresADVANCED MICRO DEVICES INC·Filed 2022·Granted Mar 11, 2025·1 cites·19 claims
- 0583US11810891B2Bond pads for low temperature hybrid bondingADVANCED MICRO DEVICES INC·Filed 2021·Granted Nov 7, 2023·1 cites·16 claims
- 0683US10943880B2Semiconductor chip with reduced pitch conductive pillarsADVANCED MICRO DEVICES INC·Filed 2019·Granted Mar 9, 2021·3 cites·19 claims
- 0778US11367628B2Molded chip package with anchor structuresADVANCED MICRO DEVICES INC·Filed 2019·Granted Jun 21, 2022·2 cites·17 claims
- 0870US11742301B2Fan-out package with reinforcing rivetsADVANCED MICRO DEVICES INC·Filed 2019·Granted Aug 29, 2023·1 cites·20 claims
- 0965US11676924B2Semiconductor chip with reduced pitch conductive pillarsADVANCED MICRO DEVICES INC·Filed 2021·Granted Jun 13, 2023·0 cites·20 claims
- 1057US2025079276A1Stiffener with integrated connectorsADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 1151US12278150B2Semiconductor package with annular package lid structureADVANCED MICRO DEVICES INC·Filed 2021·Granted Apr 15, 2025·0 cites·24 claims
- 1250US12394683B2Molded semiconductor chip package with stair-step molding layerADVANCED MICRO DEVICES INC·Filed 2020·Granted Aug 19, 2025·0 cites·22 claims
- 1349US2022199429A1Structural thermal interfacing for lidded semiconductor packagesADVANCED MICRO DEVICES INC·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →