Inventor · disambiguated record
Purnima Narayanan
Also filed as: NARAYANAN PURNIMA
19 granted patents·3 pending applications·54 citations·filing 2013–2025
92Inventor score
Top patents by PatentIndex Score
22 records- 0196US11037956B2Integrated assemblies having charge-trapping material arranged in vertically-spaced segments, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2020·Granted Jun 15, 2021·4 cites·24 claims
- 0295US10777576B1Integrated assemblies having charge-trapping material arranged in vertically-spaced segments, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Sep 15, 2020·12 cites·48 claims
- 0394US9431410B2Methods and apparatuses having memory cells including a monolithic semiconductor channelMICRON TECHNOLOGY INC·Filed 2013·Granted Aug 30, 2016·15 cites·11 claims
- 0491US9741734B2Memory devices and systems having reduced bit line to drain select gate shorting and associated methodsINTEL CORP·Filed 2015·Granted Aug 22, 2017·8 cites·12 claims
- 0590US11672120B2Integrated assemblies having charge-trapping material arranged in vertically-spaced segments, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2021·Granted Jun 6, 2023·2 cites·19 claims
- 0689US12432925B2Integrated assemblies which include stacked memory decks, and methods of forming integrated assembliesLODESTAR LICENSING GROUP LLC·Filed 2024·Granted Sep 30, 2025·0 cites·20 claims
- 0789US10134758B2Memory devices and systems having reduced bit line to drain select gate shorting and associated methodsINTEL CORP·Filed 2017·Granted Nov 20, 2018·6 cites·20 claims
- 0888US11056505B2Integrated assemblies having one or more modifying substances distributed within semiconductor material, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Jul 6, 2021·3 cites·39 claims
- 0983US12150303B2Integrated assemblies having charge-trapping material arranged in vertically-spaced segments, and methods of forming integrated assembliesLODESTAR LICENSING GROUP LLC·Filed 2023·Granted Nov 19, 2024·0 cites·18 claims
- 1083US12010850B2Integrated assemblies which include stacked memory decks, and methods of forming integrated assembliesLODESTAR LICENSING GROUP LLC·Filed 2023·Granted Jun 11, 2024·0 cites·20 claims
- 1183US10090317B2Methods and apparatuses having memory cells including a monolithic semiconductor channelMICRON TECHNOLOGY INC·Filed 2016·Granted Oct 2, 2018·3 cites·19 claims
- 1280US2025107089A1Integrated assemblies having one or more modifying substances distributed within semiconductor material, and methods of forming integrated assembliesLODESTAR LICENSING GROUP LLC·Filed 2024·Application pending·0 cites
- 1378US11538819B2Integrated circuitry, a method used in forming integrated circuitry, and a method used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2020·Granted Dec 27, 2022·1 cites·14 claims
- 1477US2025259678A1Integrated Circuitry Comprising A Memory Array Comprising Strings Of Memory Cells And Methods Used In Forming A Memory Array Comprising Strings Of Memory CellsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1575US11744072B2Integrated assemblies which include stacked memory decksMICRON TECHNOLOGY INC·Filed 2021·Granted Aug 29, 2023·0 cites·21 claims
- 1674US12144176B2Integrated assemblies having one or more modifying substances distributed within semiconductor material, and methods of forming integrated assembliesLODESTAR LICENSING GROUP LLC·Filed 2021·Granted Nov 12, 2024·0 cites·16 claims
- 1774US11844202B2Integrated circuitry, a method used in forming integrated circuitry, and a method used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2022·Granted Dec 12, 2023·0 cites·18 claims
- 1866US12288585B2Integrated circuitry comprising a memory array comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2021·Granted Apr 29, 2025·0 cites·15 claims
- 1965US11107831B2Methods of forming integrated assemblies include stacked memory decksMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 31, 2021·0 cites·17 claims
- 2062US2024341079A1Wordline recess formation and resulting structuresMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2159US10879259B2Methods and apparatuses having memory cells including a monolithic semiconductor channelMICRON TECHNOLOGY INC·Filed 2018·Granted Dec 29, 2020·0 cites·23 claims
- 2238US10790290B23D NAND with integral drain-end select gate (SGD)INTEL CORP·Filed 2017·Granted Sep 29, 2020·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →