Inventor · disambiguated record
Pu Wang
Also filed as: WANG PU · WANG PU-WEI
114 granted patents·74 pending applications·353 citations·filing 2001–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD83MITSUBISHI ELECTRIC RES LABORATORIES INC39SCHLUMBERGER TECHNOLOGY CORP7SAS INST INC5PURDUE RESEARCH FOUNDATION4
Top patents by PatentIndex Score
188 records- 0198US11521905B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 6, 2022·5 cites·20 claims
- 0298US10867965B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·23 cites·20 claims
- 0398US10529690B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 7, 2020·35 cites·20 claims
- 0497US11996345B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 28, 2024·4 cites·20 claims
- 0597US11567183B2Radar detection of moving object with waveform separation residualMITSUBISHI ELECTRIC RES LABORATORIES INC·Filed 2020·Granted Jan 31, 2023·7 cites·13 claims
- 0697US11121816B2Symbol detection of massive MIMO systems with unknown symbol-dependent transmit-side impairmentsMITSUBISHI ELECTRIC RES LABORATORIES INC·Filed 2019·Granted Sep 14, 2021·17 cites·18 claims
- 0796US10861799B1Dummy die placement without backside chippingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 8, 2020·12 cites·20 claims
- 0896US10169720B2Systems and methods for machine learning using classifying, clustering, and grouping time series dataSAS INST INC·Filed 2016·Granted Jan 1, 2019·23 cites·27 claims
- 0995US11854877B2Semiconductor device and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·2 cites·20 claims
- 1095US11619494B2System and method for tracking expanded state of an objectMITSUBISHI ELECTRIC RES LABORATORIES INC·Filed 2020·Granted Apr 4, 2023·6 cites·18 claims
- 1193US12033912B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 9, 2024·2 cites·20 claims
- 1293US11830821B2Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 28, 2023·2 cites·20 claims
- 1393US11262184B1Optical coherence tomography (OCT) system for producing profilometry measurements of a specimenMITSUBISHI ELECTRIC RES LABORATORIES INC·Filed 2020·Granted Mar 1, 2022·3 cites·15 claims
- 1493US10290609B2Semiconductor device and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 14, 2019·5 cites·20 claims
- 1592US11923259B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 5, 2024·1 cites·20 claims
- 1692US11879964B2System and method for tracking expanded state of moving object with model geometry learningMITSUBISHI ELECTRIC RES LABORATORIES INC·Filed 2020·Granted Jan 23, 2024·3 cites·18 claims
- 1792US11804468B2Manufacturing method of semiconductor package using jigTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 31, 2023·2 cites·20 claims
- 1892US10269589B2Method of manufacturing a release film as isolation film in packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·7 cites·20 claims
- 1992US10270510B1Digital beamforming transmitter array system with hardware sharing and reductionMITSUBISHI ELECTRIC RES LABORATORIES INC·Filed 2018·Granted Apr 23, 2019·11 cites·20 claims
- 2091US11914023B2System and method for tracking an expanded state of a moving object using a compound measurement modelMITSUBISHI ELECTRIC RES LABORATORIES INC·Filed 2021·Granted Feb 27, 2024·2 cites·16 claims
- 2191US11855003B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·2 cites·20 claims
- 2291US10916450B2Package of integrated circuits having a light-to-heat-conversion coating materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 9, 2021·6 cites·19 claims
- 2391US10338994B1Predicting and adjusting computer functionality to avoid failuresSAS INST INC·Filed 2018·Granted Jul 2, 2019·11 cites·30 claims
- 2491US10217252B1See-through sensing for image reconstruction of structure of target objectMITSUBISHI ELECTRIC RES LABORATORIES INC·Filed 2018·Granted Feb 26, 2019·6 cites·20 claims
- 2589US10474968B2Improving accuracy of predictions using seasonal relationships of time series dataSAS INST INC·Filed 2018·Granted Nov 12, 2019·4 cites·30 claims
- 2689US2024379429A1Semiconductor device and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2788US12424587B2Semiconductor device having underfill surrounding bottom package and solder ballTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 2887US10382230B2System and method for channel estimation in mmWave communications exploiting joint AoD-AoA angular spreadMITSUBISHI ELECTRIC RES LABORATORIES INC·Filed 2017·Granted Aug 13, 2019·6 cites·20 claims
- 2987US9152353B1Verifying the consistency of slice allocation metadataEMC CORP·Filed 2013·Granted Oct 6, 2015·17 cites·20 claims
- 3086US12451408B2Package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 21, 2025·0 cites·20 claims
- 3186US11835673B2Methods and systems for determining fast and slow shear directions in an anisotropic formation using a logging while drilling toolSCHLUMBERGER TECHNOLOGY CORP·Filed 2021·Granted Dec 5, 2023·1 cites·20 claims
- 3286US11705381B2High efficiency heat dissipation using thermal interface material filmTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 18, 2023·1 cites·20 claims
- 3386US8907841B2Method for detecting targets using space-time adaptive processingSAHINOGLU ZAFER·Filed 2011·Granted Dec 9, 2014·14 cites·6 claims
- 3485US11009654B2Anti-resonant hollow core optical fiber having multiple resonant layersUNIV BEIJING TECHNOLOGY·Filed 2018·Granted May 18, 2021·7 cites·9 claims
- 3585US10510732B2PoP device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·4 cites·20 claims
- 3685USD758446SPortion of a display screen with animated graphical user interfaceTENCENT TECH SHENZHEN CO LTD·Filed 2013·Granted Jun 7, 2016·38 cites·1 claims
- 3784US11869822B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 9, 2024·1 cites·20 claims
- 3884US11515267B2Dummy die placement without backside chippingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·1 cites·20 claims
- 3984US9128629B1Throttling techniques for use with data relocationEMC CORP·Filed 2013·Granted Sep 8, 2015·8 cites·20 claims
- 4083US12368084B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 22, 2025·0 cites·20 claims
- 4183US10795151B2Methods and systems for terahertz-based positioningMITSUBISHI ELECTRIC RES LABORATORIES INC·Filed 2018·Granted Oct 6, 2020·2 cites·19 claims
- 4282US11122397B2Localization using millimeter wave beam attributesMITSUBISHI ELECTRIC RES LABORATORIES INC·Filed 2019·Granted Sep 14, 2021·3 cites·16 claims
- 4382US10093449B2Double-surface contact tray loading baseCRRC MEISHAN CO LTD·Filed 2016·Granted Oct 9, 2018·7 cites·5 claims
- 4482US10001442B2Optical fiber-based hybrid SERS platform for in vivo detection of bio-moleculesUNIV CALIFORNIA·Filed 2014·Granted Jun 19, 2018·3 cites·20 claims
- 4582US2025316554A1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4681US12266633B2Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 1, 2025·0 cites·20 claims
- 4781US12196679B2High throughput snapshot spectral encoding device for fluorescence spectral microscopyUNIV SOUTHERN CALIFORNIA·Filed 2021·Granted Jan 14, 2025·1 cites·30 claims
- 4881US10407274B2System and method for parameter estimation of hybrid sinusoidal FM-polynomial phase signalMITSUBISHI ELECTRIC RES LABORATORIES INC·Filed 2017·Granted Sep 10, 2019·2 cites·20 claims
- 4980US12211818B2Manufacturing method of semiconductor package using jigTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
- 5080US2024395727A1Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
Showing the top 50 of 188 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →