Inventor · disambiguated record
Pui Yin Yu
Also filed as: YU PUI YIN
11 granted patents·4 pending applications·37 citations·filing 2014–2024
86Inventor score
Top patents by PatentIndex Score
15 records- 0191US9661738B1Embedded coins for HDI or SEQ laminationsFLEXTRONICS AP LLC·Filed 2014·Granted May 23, 2017·16 cites·15 claims
- 0286US9867290B2Selective segment via plating process and structureMULTEK TECH LTD·Filed 2015·Granted Jan 9, 2018·6 cites·16 claims
- 0385US10321560B2Dummy core plus plating resist restrict resin process and structureMULTEK TECH LIMITED·Filed 2016·Granted Jun 11, 2019·5 cites·8 claims
- 0483US11122674B1PCB with coin and dielectric layerMULTEK TECH LIMITED·Filed 2020·Granted Sep 14, 2021·2 cites·20 claims
- 0582US9763327B2Selective segment via plating process and structureMULTEK TECH LTD·Filed 2015·Granted Sep 12, 2017·4 cites·16 claims
- 0674US9999134B2Self-decap cavity fabrication process and structureMULTEK TECH LIMITED·Filed 2016·Granted Jun 12, 2018·2 cites·19 claims
- 0764US10772220B2Dummy core restrict resin process and structureMULTEK TECH LIMITED·Filed 2019·Granted Sep 8, 2020·1 cites·27 claims
- 0864US9992880B2Rigid-bend printed circuit board fabricationMULTEK TECH LIMITED·Filed 2016·Granted Jun 5, 2018·1 cites·14 claims
- 0960US11317521B2Resin flow restriction process and structureMULTEK TECH LIMITED·Filed 2020·Granted Apr 26, 2022·0 cites·20 claims
- 1059US11910540B2Circuit board with solder mask on internal copper padDSBJ PTE LTD·Filed 2022·Granted Feb 20, 2024·0 cites·8 claims
- 1153US2025008677A1Electronic module having a pcb cap structureDSBJ PTE LTD·Filed 2024·Application pending·0 cites
- 1250US2017238416A1Dummy core restrict resin process and structureMULTEK TECH LTD·Filed 2016·Application pending·0 cites
- 1349US10292279B2Disconnect cavity by plating resist process and structureMULTEK TECH LIMITED·Filed 2016·Granted May 14, 2019·0 cites·11 claims
- 1436US2017339788A1Split via second drill process and structureMULTEK TECH LIMITED·Filed 2016·Application pending·0 cites
- 1533US2017271734A1Embedded cavity in printed circuit board by solder mask damMULTEK TECH LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →