Inventor · disambiguated record
Pyunghwa Han
Also filed as: HAN PYUNGHWA
0 granted patents·7 pending applications·0 citations·filing 2024–2024
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD7
Top patents by PatentIndex Score
7 records- 0164US2025372550A1Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0263US2025140619A1Semiconductor package with a fan-out level packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0362US2025054850A1Semiconductor package having a core moduleSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0460US2025105159A1Fan-out level semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0559US2025022785A1Semiconductor chip and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0652US2025029935A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0748US2025140676A1Wiring structure, method of manufacturing the wiring structure, and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →